Cavity-Stacked Semiconductor Package for Heat Dissipation and Compactness
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Solution Overview
Problem
The challenge is to develop a semiconductor package that integrates multiple semiconductor chips while minimizing volume and enhancing heat dissipation, as electronic products become smaller and lighter, requiring efficient packaging solutions to accommodate various functions within reduced space.
Innovation Solution
The semiconductor package incorporates a package substrate with a substrate cavity, a wiring interposer, a memory semiconductor structure, a logic semiconductor chip, a conductive spacer, and a heat dissipation member, where the logic semiconductor chip and conductive spacer are positioned to overlap the memory semiconductor structure vertically, facilitating heat transfer and reducing package volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are integrated in a semiconductor package, then the functionality and performance of the package are improved, but the volume of the package increases
Solution Approach 1:
The patent transitions from horizontal arrangement of semiconductor chips to a vertical three-dimensional stacked configuration. Multiple chips (logic chip, memory chip, I/O chip) are arranged at different vertical levels and connected through vertical interconnect structures, enabling multiple functions to be integrated within a reduced footprint while maintaining enhanced functionality.
Solution Approach 2:
The patent implements a nested structure where smaller functional components are integrated within or around larger structural elements. For example, conductive spacers are positioned within the substrate cavity, and underfill material is injected to fill remaining spaces, creating a compact nested arrangement that maximizes space utilization and reduces overall package volume.
2Adaptability or versatility
If multiple semiconductor chips are integrated in a semiconductor package, then the functionality and performance of the package are improved, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the semiconductor package into distinct modular segments: a substrate cavity structure, multiple independently mounted chips (logic chip, memory chip, I/O chip), conductive spacers, and underfill material. This segmentation allows each component to be manufactured and prepared separately, then assembled in a systematic sequence, reducing overall manufacturing complexity despite the multi-chip integration.
Solution Approach 2:
The patent introduces intermediary elements such as the conductive spacers and underfill material that facilitate the assembly process. The underfill material acts as a mediator that secures chips in place, fills gaps, and provides mechanical support during assembly, while conductive spacers serve as intermediaries for thermal and electrical connections, simplifying the integration of multiple chips.
3Temperature
If heat dissipation structures are added to manage thermal energy, then the thermal management performance is improved, but the volume of the package increases
Solution Approach 1:
The patent merges multiple functions into the conductive spacer structure. The spacer simultaneously serves as a thermal conduction path for heat dissipation, an electrical connection element, and a mechanical support component within the substrate cavity. This consolidation provides effective thermal management without adding separate dedicated heat dissipation structures that would increase package volume.
Solution Approach 2:
The conductive spacer is designed as a multi-functional element that performs thermal conduction, electrical connection, and structural support functions simultaneously. This universal component approach enables heat dissipation management while maintaining a compact package design, as the same structure serves multiple purposes rather than requiring separate dedicated components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat dissipation from the logic semiconductor chip and the memory semiconductor structure, improving thermal management and reducing the overall volume of the semiconductor package, enabling more compact and functional electronic devices.
Implementation Method 1
a conductive spacer spaced apart from the logic semiconductor chip in a horizontal direction, attached to the upper surface of the wiring interposer, and overlapping a part of the memory semiconductor structure in a vertical direction, and a heat dissipation member disposed over the logic semiconductor chip and the conductive spacer
Data Source
AI summary
A semiconductor package includes a package substrate including a substrate cavity, the substrate cavity extending from an upper surface of the package substrate toward a lower surface of the package substrate, a wiring interposer attached to the package substrate, a memory semiconductor structure attached to a lower surface of the wiring interposer, at least a portion of the memory semiconductor structure art being accommodated in the substrate cavity, a logic semiconductor chip attached to an upper surface of the wiring interposer, a conductive spacer spaced apart from the logic semiconductor chip in a horizontal direction, the conductive spacer being attached to the upper surface of the wiring interposer and overlapping the memory semiconductor structure in a vertical direction, and a heat dissipation member over the logic semiconductor chip and the conductive spacer.