Cavity Substrate Packaging for Dense Chips and Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in achieving high integration density and efficient heat dissipation while maintaining a compact form factor, leading to manufacturing difficulties and limitations in integrating more electronic components and improving thermal management.
Innovation Solution
A package structure with a cavity substrate is developed, featuring a package substrate with conductive and thermal features that includes a cavity for housing electronic devices, allowing for efficient thermal coupling and reduced height through the use of thermal vias and a redistribution layer (RDL) structure for electrical connections, enhancing integration density and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging technologies are used to protect semiconductor devices and provide connection interfaces, then device protection and connectivity are achieved, but the package size and height cannot be sufficiently reduced
Solution Approach 1:
The patent implements nesting by placing the semiconductor die directly inside a cavity formed in the package substrate. The cavity is etched through the substrate to create a recessed space that accommodates the die, allowing the device to be nested within the substrate structure rather than mounted on top, thereby reducing overall package height and volume while maintaining protection.
Solution Approach 2:
The patent transitions from traditional planar mounting to three-dimensional cavity integration. By creating a cavity that extends vertically through the substrate and positioning the die within this recessed space, the design utilizes the vertical dimension more efficiently, reducing the horizontal footprint and overall package volume while maintaining device connectivity and protection.
2Quantity of substance
If more electronic components are integrated into a given area to improve integration density, then functional capacity increases, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces thermal vias as intermediary heat transfer pathways. These vias are formed as conductive structures extending through the package substrate, acting as thermal conduits that conduct heat away from the semiconductor die located in the cavity. The thermal vias provide dedicated heat dissipation pathways that do not interfere with the high-density component integration, effectively managing thermal loads.
Solution Approach 2:
The patent applies local quality by creating regions of high thermal conductivity specifically where needed - within the cavity and through the substrate via thermal vias. The package substrate is designed with localized thermal management features concentrated around the die location, providing enhanced heat dissipation capability precisely where the heat is generated by high-density components, while other areas maintain their structural and electrical functions.
3Length of stationary object
If package height is reduced to achieve a compact form factor, then space efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent segments the package substrate into distinct functional regions: a cavity region for die placement, thermal via regions for heat dissipation, and RDL regions for electrical connectivity. The manufacturing process is segmented into discrete steps - cavity formation through etching, thermal via creation, die placement in the cavity, and RDL formation - allowing each segment to be optimized and controlled independently, thereby managing manufacturing complexity while achieving reduced package height.
Solution Approach 2:
The patent employs preliminary action by pre-forming the cavity and thermal vias in the package substrate before die attachment. The cavity is etched and thermal vias are created in advance, preparing the substrate structure ahead of time. This preliminary preparation simplifies subsequent assembly steps, as the die can be directly placed into the pre-formed cavity and connected to pre-positioned thermal and electrical pathways, reducing overall manufacturing complexity despite the three-dimensional structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher integration density and improved thermal management, reducing the package height and form factor while maintaining high input/output density and reducing parasitic resistance, thus facilitating the integration of more electronic components and enhancing circuit functions.
Implementation Method 1
thermal vias and a redistribution layer (RDL) structure for electrical connections, enhancing integration density and heat dissipation
Data Source
AI summary
A package structure is provided. The package structure includes a substrate including a cavity and a plurality of thermal vias connecting a bottom surface of the cavity to a bottom surface of the substrate. The package structure also includes an electronic device disposed in the cavity and thermally coupled to the plurality of thermal vias. The package structure further includes a plurality of conductive connectors formed over the electronic device and vertically overlapping the plurality of thermal vias. The package structure also includes an encapsulating material extending from top surfaces of the plurality of conductive connectors to the bottom surface of the cavity. The package structure further includes an insulating layer formed over the encapsulating material and including a redistribution layer structure electrically connected to the electronic device through the plurality of conductive connectors.