Cavity Substrate Fan-Out Packaging for High-I/O Miniaturization
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Solution Overview
Problem
The semiconductor industry faces challenges in miniaturizing integrated circuits while maintaining high functionality and cost-effectiveness, particularly in achieving smaller package sizes for applications requiring miniaturization without compromising performance.
Innovation Solution
The development of an Integrated Fan-Out (InFO) package using a heterogeneous substrate with cavities to reduce overall height, incorporate metallization layers for signal redistribution, and form redistribution structures on both sides of the integrated circuits, allowing for greater flexibility in dimensions while maintaining a smaller profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are packaged with high functionality requiring many input/output pads, then the package size increases, but miniaturization is required for certain applications
Solution Approach 1:
The patent implements fan-out wiring that extends laterally beneath the substrate in a second dimension, allowing I/O pads to be distributed over a larger area without increasing the vertical profile. This enables high-density I/O connectivity while maintaining a compact package footprint by utilizing the substrate thickness dimension for wiring routing.
Solution Approach 2:
The patent embeds fan-out wiring structures within recesses and cavities of the substrate, nesting the wiring layers inside the substrate volume rather than extending externally. This nested arrangement allows multiple wiring layers to be contained within the substrate thickness, achieving high functionality without proportionally increasing package size.
2Length of stationary object
If substrate thickness is reduced to achieve smaller package profile, then mechanical strength and warpage control become problematic
Solution Approach 1:
The patent divides the substrate into multiple segments with recesses and cavities at different levels, creating a stepped or layered structure. This segmentation allows the substrate to maintain adequate local thickness in critical areas for mechanical strength while achieving overall thickness reduction for miniaturization. The segmented structure also provides pathways for fan-out wiring to route signals without requiring uniform thinning across the entire substrate.
Data Source
AI summary
Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.