Cavity Packaging Substrate With Heat Dissipation Vias
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Solution Overview
Problem
Current semiconductor packaging technologies fail to provide effective heat dissipation and long-term durability, particularly when using ceramic or resin substrates, which can lead to performance degradation and manufacturing defects.
Innovation Solution
A packaging substrate with a core substrate made of ceramic, glass, or a combination thereof, featuring a cavity portion and a first heat dissipation portion with heat dissipation vias that include a thermally conductive layer, designed to efficiently transmit heat and maintain substrate integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ceramic substrate is used for packaging, then heat dissipation is improved, but mounting of high-performance and high-frequency semiconductor elements becomes difficult due to high resistance value or high dielectric constant
Solution Approach 1:
The patent applies different materials to different regions of the packaging substrate. The core substrate uses ceramic for heat dissipation, while the mounting region uses resin with lower dielectric constant and resistance for high-frequency signal transmission. This local differentiation resolves the contradiction by allowing each region to optimize for its specific function.
Solution Approach 2:
The patent creates a composite packaging substrate by combining ceramic core substrate with resin mounting region. This composite structure integrates the thermal conductivity benefits of ceramic with the electrical performance benefits of resin, simultaneously achieving both heat dissipation and compatibility with high-performance semiconductor elements.
2Adaptability or versatility
If resin substrate is used for packaging, then mounting of high-performance and high-frequency semiconductor elements is improved, but pitch reduction of wirings is limited
Solution Approach 1:
The patent differentiates the mounting region from the core substrate by using resin material that provides both good electrical characteristics for high-frequency signals and suitable mechanical properties for fine wiring pitch reduction, while the ceramic core handles thermal management.
3Reliability
If through-hole is formed in silicon or glass substrate and conductive material is applied, then wiring length between element and motherboard is shortened and electrical characteristics are improved, but heat dissipation and long-term durability are insufficient
Solution Approach 1:
The patent replaces单一的 silicon or glass substrate with a composite structure of ceramic core substrate and resin mounting region. The ceramic core provides both the structural integrity for through-hole wiring and superior heat dissipation capabilities, while the resin region maintains good electrical characteristics for signal transmission.
Solution Approach 2:
The patent segments the substrate into functional regions: ceramic core for thermal management and structural support, and resin mounting region for electrical performance and element mounting. This segmentation allows each region to optimize for its primary function while working together as an integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent heat dissipation characteristics and long-term durability by effectively managing heat transfer and reducing thermal expansion mismatches, thereby enhancing the performance and reliability of semiconductor packages.
Implementation Method 1
The first heat dissipation portion is a thermal path through which heat of the packaging substrate is transmitted to the outside
Implementation Method 2
The heat dissipation via includes a thermally conductive layer
Data Source
AI summary
A packaging substrate according to an embodiment has an upper surface and a lower surface. The packaging substrate includes a mounting region in which an element is accommodated and a core substrate in which the mounting region is disposed.The mounting region includes a cavity portion formed by recessing a portion of the core substrate, a cavity portion side surface formed inside the core substrate in a thickness direction of the core substrate to form an outer periphery of the cavity portion, and a first heat dissipation portion disposed adjacent to the outer periphery of the cavity portion.The first heat dissipation portion is a thermal path through which heat of the packaging substrate is transmitted to the outside.The first heat dissipation portion includes one or more heat dissipation vias each having an area of 5,000 μm2 to 75 mm2 when viewed from the upper surface of the packaging substrate.The packaging substrate may effectively emit heat generated during an element driving process, and may have excellent long-term durability and reliability.