Cavity Packaging Substrate With Heat Dissipation Vias for Durability
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Solution Overview
Problem
Existing semiconductor packaging technologies fail to provide effective heat dissipation and long-term durability, limiting the electrical performance of semiconductors due to high resistance and pitch limitations in ceramic and resin substrates, and silicon or glass substrates face challenges in heat dissipation and durability.
Innovation Solution
A packaging substrate with a core substrate featuring a cavity portion and a first heat dissipation portion comprising heat dissipation vias, which are strategically designed to enhance heat transmission and durability by controlling area, aspect ratio, spacing, and thermal expansion coefficients, along with a second heat dissipation portion for additional heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic substrate is used for packaging, then durability is improved, but heat dissipation performance deteriorates due to high resistance value and high dielectric constant
Solution Approach 1:
The patent uses a composite substrate structure combining organic resin material with ceramic coating layers. The core substrate is made of organic resin (EP, BT, or TG based) which provides good heat dissipation, while ceramic coating layers (alumina, aluminum nitride, or silicon nitride) are applied on the surface to provide durability and protection. This composite structure resolves the contradiction by getting the heat dissipation benefit from the organic core and the durability benefit from the ceramic coating.
Solution Approach 2:
The patent applies ceramic coating only in specific regions where durability is needed, rather than making the entire substrate ceramic. The ceramic coating is applied on the upper surface and side surfaces of the core substrate, creating a local quality enhancement. This allows the bulk of the substrate to remain organic for heat dissipation while providing ceramic protection where required for durability.
2Temperature
If resin substrate is used for packaging, then heat dissipation performance is improved, but durability deteriorates due to pitch reduction limitations and lower structural strength
Solution Approach 1:
The patent uses a composite substrate structure combining organic resin material with ceramic coating layers. The core substrate is made of organic resin (EP, BT, or TG based) which provides good heat dissipation, while ceramic coating layers (alumina, aluminum nitride, or silicon nitride) are applied on the surface to provide durability and protection. This composite structure resolves the contradiction by getting the heat dissipation benefit from the organic core and the durability benefit from the ceramic coating.
Solution Approach 2:
The patent applies ceramic coating only in specific regions where durability is needed, rather than making the entire substrate ceramic. The ceramic coating is applied on the upper surface and side surfaces of the core substrate, creating a local quality enhancement. This allows the bulk of the substrate to remain organic for heat dissipation while providing ceramic protection where required for durability.
3Reliability
If silicon or glass substrate is used for packaging, then electrical characteristics are improved by shortening wiring length, but heat dissipation and durability challenges arise
Solution Approach 1:
The patent uses a composite substrate structure combining organic resin material with ceramic coating layers. The core substrate is made of organic resin (EP, BT, or TG based) which provides good heat dissipation, while ceramic coating layers (alumina, aluminum nitride, or silicon nitride) are applied on the surface to provide durability and protection. This composite structure resolves the contradiction by getting the heat dissipation benefit from the organic core and the durability benefit from the ceramic coating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent heat dissipation characteristics and long-term durability, effectively managing heat generated by active elements, reducing overheating, and suppressing substrate defects, thereby enhancing the electrical performance and reliability of semiconductor packages.
Implementation Method 1
The first heat dissipation portion is a thermal path through which heat of the packaging substrate is transmitted to the outside
Data Source
Figure 1a
Figure 1b
Figure 2a
AI summary
A packaging substrate according to an embodiment has an upper surface and a lower surface. The packaging substrate includes a mounting region in which an element is accommodated and a core substrate in which the mounting region is disposed. The mounting region includes a cavity portion formed by recessing a portion of the core substrate, a cavity portion side surface formed inside the core substrate in a thickness direction of the core substrate to form an outer periphery of the cavity portion, and a first heat dissipation portion disposed adjacent to the outer periphery of the cavity portion. The first heat dissipation portion is a thermal path through which heat of the packaging substrate is transmitted to the outside. The first heat dissipation portion includes one or more heat dissipation vias each having an area of 5,000 µm2 to 75 mm2 when viewed from the upper surface of the packaging substrate. The packaging substrate may effectively emit heat generated during an element driving process, and may have excellent long-term durability and reliability.