Cavity Substrate Lid Adhesive Vent Seal Semiconductor Package
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The design involves a cavity substrate with a substrate base, cavity wall, and electronic component enclosed by a lid, utilizing adhesives and vent seals to create a semiconductor package that provides protection and electrical coupling while relieving pressure differences through venting channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but package size becomes too large and cost increases
Solution Approach 1:
The semiconductor die is nested within a cavity formed in the substrate, and the entire assembly is then enclosed by a lid. This nested configuration allows the package to be compact while maintaining structural integrity and protecting the die, thereby reducing overall package size without significantly complicating the manufacturing process.
Solution Approach 2:
The invention transitions from a planar packaging approach to a three-dimensional cavity structure. By forming a cavity within the substrate and placing the die vertically within it, then covering with a lid, the package achieves compactness in the horizontal plane while utilizing vertical space efficiently, thus reducing package footprint.
2Reliability
If conventional packaging structures are used, then manufacturing processes remain simple, but reliability decreases
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the lid and the substrate cavity wall. This adhesive mediator ensures reliable bonding and sealing, preventing environmental contaminants from reaching the die while accommodating thermal expansion differences, thereby enhancing reliability without requiring complex mechanical fastening structures.
Solution Approach 2:
The invention extracts the sealing and protective functions from the traditional package body and concentrates them in a dedicated lid component that seals the cavity. This separation allows the substrate to focus on electrical interconnection while the lid provides environmental protection, improving reliability through functional specialization.
3Object-affected harmful factors
If sealed cavity structures are used, then environmental protection is improved, but pressure differences cause reliability issues
Solution Approach 1:
The invention converts the harmful effect of pressure differential into a beneficial sealing mechanism. The compliant adhesive layer is designed to deform under pressure differential, creating an enhanced seal between the lid and substrate. Thus, the pressure that would normally compromise reliability is instead utilized to improve the sealing effect and protect the die from environmental contaminants.
4Productivity
If package size is reduced, then performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The invention changes the physical state and mechanical properties of the adhesive layer to be compliant and deformable. This parameter change allows the adhesive to accommodate minor dimensional variations and misalignments during assembly, reducing the stringency of manufacturing precision requirements while maintaining the compact package design that delivers high performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and performance of semiconductor packages by reducing costs and package size, while ensuring environmental protection and efficient pressure management.
Implementation Method 1
an adhesive between the bottom side of the lid and a top side of the cavity wall
Implementation Method 2
a vent seal between the interior of the cavity and the exterior of the cavity
Data Source
AI summary
In one example, an electronic device comprises a cavity substrate comprising a substrate base comprising a top side and a bottom side and a cavity wall over the substrate base and defining a cavity, an electronic component over the substrate base and in the cavity, a lid comprising a top side and a bottom side, wherein the lid is over the substrate base and the cavity wall to define an interior of the cavity and an exterior of the cavity, an adhesive between the bottom side of the lid and a top side of the cavity wall, and a vent seal between the interior of the cavity and the exterior of the cavity. Other examples and related methods are also disclosed herein.