Cavity Substrate Directional Optoelectronic Channel
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Solution Overview
Problem
Current optoelectronic transceiver module manufacturing processes are inefficient, with poor external force resistance, loose assembly, and vulnerability to water vapor erosion, and existing miniaturization solutions require additional metal blocking walls to prevent signal interference, increasing complexity and cost.
Innovation Solution
A cavity substrate with a directional optoelectronic transmission channel is created, featuring a support frame with dielectric layers and circuit layers, allowing for the integration of optical communication devices within a cavity, eliminating the need for surface mounting and metal blocking walls, thereby reducing packaging volume and manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional surface mounting methods are used for optoelectronic devices, then the manufacturing process is simple, but the packaging volume is large and signal interference occurs
Solution Approach 1:
The patent transitions from surface mounting (2D) to cavity integration (3D), embedding optoelectronic devices within a cavity formed by dielectric layers on the support frame. This dimensional change enables compact packaging while maintaining signal integrity through directional transmission channels.
Solution Approach 2:
The patent divides the substrate into functional regions: support frame, first dielectric layer with cavity, second dielectric layer, and distinct circuit layers. This segmentation allows independent optimization of each component and facilitates precise positioning of optoelectronic devices without requiring metal blocking walls.
2Reliability
If metal blocking walls are added to prevent signal interference, then signal isolation is improved, but manufacturing steps increase and cost increases
Solution Approach 1:
The patent removes the metal blocking wall component entirely, achieving signal isolation through the inherent directional transmission properties of the cavity structure and dielectric layers. This extraction eliminates additional manufacturing steps while maintaining reliable signal isolation.
Solution Approach 2:
The dielectric layers and cavity structure serve as intermediary elements that provide natural electromagnetic isolation between light emitting and light receiving devices, replacing the need for metal blocking walls while facilitating easier manufacturing.
3Productivity
If multiple assembly stages are used for optoelectronic transceiver modules, then component integration is achieved, but production efficiency decreases and assembly tightness deteriorates
Solution Approach 1:
The patent merges multiple assembly stages into a single integrated cavity structure, where optoelectronic devices are simultaneously positioned and fixed within the cavity formed by the dielectric layers. This consolidation improves production efficiency while maintaining assembly tightness through unified structural support.
Solution Approach 2:
The dielectric layers act as flexible packaging structures that can accommodate optoelectronic devices while providing precise positioning and secure fixation, achieving both high production efficiency and excellent assembly tightness in a single manufacturing process.
Data Source
AI summary
A cavity substrate may have a directional optoelectronic transmission channel. The cavity substrate includes a support frame, a first dielectric layer on a first surface of the support frame, and a second dielectric layer on a second surface of the support frame. The support frame, the first dielectric layer and the second dielectric layer constitute a closed cavity having an opening on one side in the length direction of the substrate, a first circuit layer is arranged on the inner surface of the first dielectric layer facing the cavity, an electrode connected with an optical communication device is arranged on the first circuit layer, the electrode is electrically conducted with the first circuit layer, a second circuit layer is arranged on the outer surfaces of the first dielectric layer and the second dielectric layer, and the first circuit layer and the second circuit layer are communicated through a via column.