Cavity Thermal Stack in Package-on-Package for Direct Heat Conduction
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Solution Overview
Problem
Current package-on-package (PoP) systems lack effective thermal solutions to manage heat transfer between processor and memory packages, leading to inadequate thermal performance and potential overheating.
Innovation Solution
Embedding a thermal stack within a cavity in the PoP substrate provides a direct thermal pathway between the packages, reducing the number of thermal interfaces and optimizing thermal conduction by using a combination of thermal interface materials and thermally conductive substrates, such as copper and silicon, to balance heat transfer in various directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an air-gap is used between the memory package and the mold layer of the processor package, then the structural simplicity is maintained, but the thermal conduction performance deteriorates
Solution Approach 1:
The patent removes the air-gap between the memory package and processor package mold layer, extracting the thermal barrier element to enable direct thermal contact and improve heat transfer efficiency
Solution Approach 2:
The patent employs composite thermal interface materials with varying thermal conductivities at different locations to optimize heat transfer while maintaining structural integrity, using materials such as copper, aluminum, and thermally conductive polymers in combination
2Temperature
If direct thermal coupling is implemented between processor and memory packages, then thermal conduction is improved, but the thermal load on memory dies increases
Solution Approach 1:
The patent implements spatially varying thermal conductivity in the thermal interface material, with higher thermal conductivity regions positioned to conduct heat away from processor dies and lower thermal conductivity regions that prevent excessive heat transfer to memory dies, creating a gradient structure that optimizes thermal management
Solution Approach 2:
The patent introduces a thermal interface material as an intermediary substance between the processor and memory packages that mediates heat transfer, controlling the thermal coupling strength to improve processor cooling while protecting memory dies from excessive thermal load
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal performance by reducing thermal interfaces and optimizing heat management, preventing overheating and improving the overall thermal efficiency of the system.
Implementation Method 1
thermal stack embedded in a cavity in the PoP substrate... provides a direct thermal pathway between the dies of the memory package and the dies of the processor package... optimizing thermal conduction
Implementation Method 2
optimizing thermal conduction by using a combination of thermal interface materials and thermally conductive substrates, such as copper and silicon, to balance heat transfer in various directions
Data Source
AI summary
Embodiments disclosed herein include an electronics package and methods of forming such electronics packages. In an embodiment, the electronics package comprises a package substrate, and a first die coupled to the package substrate. In an embodiment, a cavity is formed through the package substrate. In an embodiment, the cavity is within a footprint of the first die. In an embodiment, the electronics package further comprises a thermal stack in the cavity. In an embodiment, the thermal stack contacts the first die.