Integrated CD Calibration Module for Semiconductor Bake Chambers
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Solution Overview
Problem
Conventional semiconductor manufacturing processes face limitations in miniaturizing patterns due to fixed airflow and temperature uniformity during post-exposure bake (PEB) processes, which restricts critical dimension (CD) measurement and calibration, thereby affecting yield and pattern miniaturization.
Innovation Solution
A substrate treating apparatus is integrated within semiconductor manufacturing equipment, featuring a load port system, buffer module, index module, transfer module, and process chambers for CD measurement and calibration, utilizing an inspection module, control module, and calibration module with a laser light source for precise CD calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat treatment methods are used during PEB process, then temperature uniformity can be optimized, but airflow is fixed and pattern miniaturization is restricted
Solution Approach 1:
The patent introduces a movable airflow control mechanism that allows dynamic adjustment of airflow parameters during the PEB process. The airflow controller can vary flow rates and patterns in real-time, transforming the previously fixed airflow system into a dynamic one that adapts to different pattern sizes and processing requirements, thereby enabling pattern miniaturization while maintaining temperature uniformity.
Solution Approach 2:
The patent changes multiple process parameters simultaneously, including airflow rate, airflow pattern, and temperature distribution. By coordinating these parameter changes through the controller, the system achieves both temperature uniformity and enhanced pattern miniaturization capability, resolving the contradiction between maintaining stable thermal conditions and adapting to smaller feature sizes.
2Reliability
If CD measurement and calibration are performed using traditional methods, then yield monitoring is possible, but manufacturing precision for miniaturized patterns is limited
Solution Approach 1:
The patent replaces traditional mechanical or optical CD measurement methods with a laser-based measurement system. The laser apparatus provides non-contact, high-precision measurement capability that can accurately measure critical dimensions of miniaturized patterns without physical contact, thereby improving manufacturing precision while maintaining reliable yield monitoring.
Solution Approach 2:
The system performs preliminary CD measurement and calibration before final processing steps. By measuring and calibrating the critical dimensions early in the process using the laser apparatus, the system can adjust subsequent processing parameters to ensure accurate pattern formation, thereby improving manufacturing precision for miniaturized features while maintaining yield reliability.
3Device complexity
If equipment structure is simplified by removing heat treatment apparatus, then device complexity is reduced, but CD calibration capability may be compromised
Solution Approach 1:
The patent integrates multiple functions into the laser apparatus, which serves both as a measurement tool and a calibration tool. The laser system can perform CD measurement, pattern formation through laser irradiation, and calibration of the photolithography system. This multi-functionality eliminates the need for separate heat treatment apparatus while maintaining full CD calibration capability, thereby simplifying equipment structure without compromising precision.
Solution Approach 2:
The patent extracts the essential calibration function from the traditional heat treatment apparatus and transfers it to the laser system. By taking out the CD calibration capability and embedding it in the laser apparatus, the system achieves structural simplification while preserving the critical calibration function needed for manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise CD measurement and calibration, improving yield and allowing for miniaturization of patterns by using a laser light source for calibration, replacing traditional heat treatment methods, and simplifying the internal structure of the equipment.
Implementation Method 1
the substrate treating apparatus performs the CD measurement and calibration on at least one substrate that has gone through a hard bake process, a post exposure bake (PEB) process, or an exposure process or applies heat to a substrate to be subject to the PEB process, using a laser light source
Data Source
AI summary
There are provided a substrate treating apparatus for critical dimension (CD) measurement and calibration, arranged in a facility where a bake process or a development process is performed on semiconductor substrates, and semiconductor manufacturing equipment including the substrate treating apparatus. The semiconductor manufacturing equipment includes: load ports where containers loaded with a plurality of substrates are mounted; a buffer module temporarily storing the substrates; an index module transferring the substrates between the load ports and the buffer module; a plurality of process chambers treating the substrates; a transfer module transferring the substrates between the buffer module and the process chambers; and a substrate treating apparatus performing CD measurement and calibration on the substrates, wherein the substrate treating apparatus is disposed adjacent to the process chambers.