CD Metrology System Classifying Semiconductor Structural Elements
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Solution Overview
Problem
In multi-layered patterning techniques, similar structural elements from different manufacturing stages are indistinguishable, making it difficult to properly adjust manufacturing parameters for precise control and evaluation.
Innovation Solution
A computerized method and system for recognizing and classifying structural elements by obtaining images of semiconductor structures, identifying features indicative of manufacturing stages, and using these assessments to differentiate between structural elements originating from different stages, such as core and gap spaces or lines, through image analysis and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional CD metrology is used to evaluate multi-layered patterns, then general dimensional measurement is achieved, but similar structural elements from different manufacturing stages become indistinguishable
Solution Approach 1:
The patent segments the evaluation of structural elements by introducing stage-specific feature assessment. Instead of treating all similar elements uniformly, the system divides them into groups based on their manufacturing stage origin (first stage vs. second stage elements), enabling differentiated analysis and preservation of stage-specific information while maintaining dimensional measurement capabilities.
2Manufacturing precision
If multi-layered patterning techniques are employed to achieve high-density structures, then manufacturing precision is improved, but the complexity of distinguishing and controlling individual elements increases
Solution Approach 1:
The patent applies local quality by assigning different assessment criteria to different groups of structural elements based on their manufacturing stage. First stage elements are evaluated using specific features, while second stage elements use different features, allowing the system to handle complexity through localized, stage-specific evaluation rather than a single complex universal approach.
3Ease of operation
If all structural elements are treated uniformly in metrology evaluation, then processing simplicity is maintained, but proper adjustment of manufacturing parameters for different stages becomes impossible
Solution Approach 1:
The patent introduces dynamic adaptability by enabling the metrology system to automatically adjust its assessment methodology based on the identified manufacturing stage of each structural element. The system dynamically selects appropriate features and evaluation criteria for each element group, maintaining operational simplicity through automation while achieving precise stage-specific parameter control.
Data Source
AI summary
A CD metrology system and method of classifying similar structural elements. The method includes: a) obtaining an image of the semiconductor structure; b) identifying sufficient numbers of structural elements belonging to first and second groups of similar structural elements, each group originating from a different manufacturing stage; c) assessing to each given structural element within the sufficient numbers of structural elements belonging to the first and second groups, one or more features indicative of a respective manufacturing stage, wherein values of the respective features are derived from the obtained image and; d) using results of the assessment for a classification decision related to manufacturing stages and, respectively, originating therefrom structural elements in the first and second groups of similar structural elements.