Ceiling Fan Wiring Simplification via Integrated Electronic Assembly

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Solution Overview

Problem

Conventional ceiling fan structures face complex and error-prone wiring due to numerous electronic components, which also hinder effective heat dissipation because of overcrowding.

Innovation Solution

A ceiling fan structure with a hanging plate featuring a recessed accommodating groove for the receiver and a support plate for the motor forward/reverse rotation module, utilizing an integrated output flat cable connector to simplify wiring and maintain component spacing for improved ventilation and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple electronic components are arranged on the support plate, then the functionality is enhanced, but the wiring becomes complicated and error-prone

Engineering Contradiction:
ImprovefunctionalityVSAvoidwiring complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple electronic components (receiver, motor forward/reverse rotation module, capacitor) into an integrated assembly that is mounted as a single unit on the support plate. This merging approach maintains all necessary functionalities while significantly reducing the number of individual wiring connections required, as the integrated assembly uses a unified wiring interface rather than separate connections for each component.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The support plate is designed with a universal mounting structure that can accommodate the integrated electronic assembly through a standardized interface. The integrating plate serves multiple functions: it provides structural support, electrical connection, and mechanical mounting for the integrated components, eliminating the need for separate wiring arrangements for each individual component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple electronic components are arranged on the support plate, then the functionality is enhanced, but the space is insufficient causing components and wires to crowd each other

Engineering Contradiction:
ImprovefunctionalityVSAvoidavailable space
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

By merging multiple electronic components into a single integrated assembly, the patent reduces the total space occupied on the support plate. Instead of allocating separate areas for each component and their associated wiring, the integrated assembly occupies one consolidated space, eliminating the crowding problem while maintaining all necessary functionalities.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated electronic assembly is nested within a compact housing structure that is mounted on the support plate. This nesting approach allows multiple components to be arranged in a space-efficient manner within the housing, reducing the overall footprint on the support plate and preventing crowding between components and wires.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Area of stationary object

If components and wires are crowded together, then the space utilization is improved, but heat dissipation is hindered

Engineering Contradiction:
Improvespace utilizationVSAvoidheat dissipation
Core Design Contradiction:
Area of stationary objectVSTemperature

Solution Approach 1:

The patent merges the electronic components into an integrated assembly with a unified housing structure that incorporates dedicated heat dissipation features. This merging allows for better thermal management by consolidating heat-generating components within a controlled enclosure that can be strategically positioned for optimal heat dissipation, rather than spreading them out where heat would be dispersed less effectively.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated assembly housing is designed with localized heat dissipation features such as ventilation openings, heat sinks, or thermally conductive materials in specific areas where heat generation is highest. This local quality approach ensures that heat dissipation is optimized at critical hot spots while maintaining compact space utilization, rather than relying on uniform spacing that would waste space.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11555501B2Ceiling fan structure
Publication Date: 2023.01.17 YAO CHAO CHIN
  • US11555501B2 patent drawing
  • US11555501B2 patent drawing
  • US11555501B2 patent drawing

AI summary

A ceiling fan structure includes a mounting bracket, a hanging plate, a coupling, and a motor. The mounting bracket is fixed to a ceiling. The hanging plate has a top fixed to the mounting bracket. The top is formed with a recessed accommodating groove for accommodating a first electronic component. The coupling is connected to a bottom of the accommodating groove and extends downward. The coupling is connected with a support plate extending horizontally. The support plate is configured to support a second electronic component. The internal space of the ceiling fan structure is properly planned so that the components of the ceiling fan structure can be reasonably configured, so as to improve the efficiency of assembly.