Ceiling-Mounted FOUP Storage Layout for Fab Footprint Reduction
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Solution Overview
Problem
Semiconductor fabrication facilities face challenges in managing space for intermediate wafer storage due to the footprint limitations of ground-type storage devices, necessitating innovative solutions to optimize storage capacity while minimizing facility footprint.
Innovation Solution
A wafer storage and transport system that utilizes ceiling-mounted storage spaces and an Overhead Hoist Transport (OHT) system, featuring a transport unit with extendable arms and rails, to efficiently move and store Front Opening Unified Pods (FOUPs) within the facility, reducing the need for ground-level storage devices and optimizing vertical space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If ground-type storage devices are installed on the bottom surface of the fab, then wafer storage function is provided, but footprint area is occupied and limits facility placement
Solution Approach 1:
The patent transitions from ground-level (2D horizontal) storage to ceiling-mounted (3D vertical) storage. Storage spaces are installed on the ceiling surface, utilizing the vertical dimension to store FOUPs without occupying additional footprint area on the factory floor.
Solution Approach 2:
Instead of placing storage devices on the bottom surface as conventionally done, the patent inverts the approach by mounting storage spaces on the ceiling surface, fundamentally changing the spatial arrangement from ground-up to ceiling-down storage.
2Area of stationary object
If ceiling-mounted storage spaces are installed, then footprint area is reduced, but complexity of transport system increases
Solution Approach 1:
The transport unit is designed with multi-functionality, capable of performing both horizontal transport along rails and vertical lifting via extendable arms. This single unit handles FOUPs from storage spaces to interface ports, reducing the need for separate specialized devices and simplifying the overall system.
Solution Approach 2:
The transport unit employs nested structural elements, including extendable arms that can be retracted or extended as needed. The arms are integrated into the transport unit body, creating a compact configuration that reduces complexity when not in use while providing full functionality when required.
3Adaptability or versatility
If transport unit with extendable arms is used, then flexibility in FOUP access is improved, but device complexity increases
Solution Approach 1:
The transport unit incorporates dynamic elements through its extendable arms that can adjust their length and position. This dynamic capability allows the arms to reach FOUPs at different locations within storage spaces and interface ports, providing flexible access while maintaining a relatively simple base structure.
Data Source
AI summary
A wafer storage and transport system includes a ceiling surface which includes a first surface and a second surface, a first traveling rail installed on the second surface, a second traveling rail which is spaced apart from the first surface in a third direction, and extends in a first direction, a transport unit which is movable in the first direction along the second traveling rail and transports a FOUP, storage spaces installed on the first surface and which may store the FOUP, an interface port installed on the second surface and which temporarily stores the FOUP, and an OHT which is movable along the first traveling rail, wherein the transport unit grasps the FOUP arranged in the storage spaces and transports the FOUP to the interface port, and the OHT grasps the FOUP temporarily stored in the interface port and transports the FOUP to a semiconductor facility.