Ceiling Heater Layout for Uniform Heating Without Element Deformation
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in maintaining temperature uniformity and preventing deformation of the ceiling heater's heating element, which can lead to inefficient film formation and reduced durability.
Innovation Solution
A ceiling heater design featuring a disk-shaped base structure with a meandering heating element that covers multiple fan-shaped regions, where the heating element is connected at predetermined locations and accommodated in a groove on the base structure, with a wider interval between adjacent regions to accommodate thermal expansion and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heating element is continuously extended to cover multiple regions, then temperature uniformity is improved, but the heating element deforms due to thermal expansion
Solution Approach 1:
The base structure is divided into multiple regions separated by walls, and the heating element is correspondingly segmented to extend across these regions. This segmentation allows each portion of the heating element to expand independently within its region, preventing cumulative deformation while maintaining overall temperature uniformity through the continuous extension across multiple regions.
Solution Approach 2:
Different portions of the heating element are positioned in different regions with different thermal expansion characteristics. The heating element is designed to have varying local properties, with each region's heating portion optimized for its specific location, allowing local thermal management while achieving global temperature uniformity.
2Manufacturing precision
If the heating element is continuously extended, then film thickness uniformity is improved, but the heating element contacts the reaction tube
Solution Approach 1:
The heating element is segmented into multiple portions located in different regions, each separated by walls. This segmentation prevents the heating element from continuously extending and contacting the reaction tube, while still achieving film thickness uniformity through the distributed heating across multiple regions.
Solution Approach 2:
Walls are introduced as intermediary structures between adjacent regions, physically separating portions of the heating element. These walls act as mediators that prevent direct contact between the heating element and the reaction tube while allowing thermal energy to be distributed uniformly across the processing area.
3Stability of the object's composition
If the heating element is accommodated in a groove, then structural stability is improved, but thermal expansion is restricted causing deformation
Solution Approach 1:
The groove structure is segmented into multiple regions separated by walls, with each groove portion accommodating a corresponding segment of the heating element. This segmentation allows each heating element portion to expand thermally within its own groove region without being constrained by adjacent regions, maintaining structural stability while accommodating thermal expansion.
Solution Approach 2:
Each groove region is designed with local characteristics optimized for its specific position, allowing different portions of the heating element to experience different thermal expansion conditions. This local optimization enables the heating element to maintain structural stability in each region while accommodating thermal expansion variations across different locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances temperature uniformity above the reaction tube, improves film thickness uniformity, and extends the lifespan of the ceiling heater by suppressing deformation and preventing contact with the reaction tube, thus ensuring consistent and efficient film formation.
Implementation Method 1
a process of forming a film on a substrate placed in a process vessel may be performed while heating an inside of the process vessel with a heater
Implementation Method 2
an interval between portions of the heating element located respectively in two adjacent regions among the plurality of regions is set to be wider than a width of a wall separating the two adjacent regions
Data Source
AI summary
To suppress deformation of a heating element, there is provided a technique that includes: a disk-shaped base structure; and a heating element continuously extending to cover multiple regions of the base structure, wherein a circle centered on a center of the base structure is divided into fan shapes by the regions. A portion of the heating element in each of the plurality of regions is connected to another portion of the heating element in an adjacent region thereof at a predetermined location. The base structure includes a groove corresponding to a shape of the heating element, a wall is formed on an area of the base structure other than where the groove is located, and an interval between portions of the heating element located in two adjacent regions among the plurality of regions is set to be wider than a width of the wall separating the two adjacent regions.