Ceiling Heater Zoning for Uniform Wafer Temperature Stabilization
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Solution Overview
Problem
In vertical type substrate processing apparatuses, temperature deviations often occur between the uppermost and lowermost wafers, prolonging the time required to stabilize the temperature of multiple substrates.
Innovation Solution
A ceiling heater with a heat generating element divided into a central portion and an outer peripheral portion, allowing for independent adjustment of heating amounts, is used. The heater's design ensures that end portions of the outer peripheral portion are not adjacent to the outermost turnaround portions, improving temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater surrounds the process vessel to heat the interior, then the temperature of the substrates can be elevated, but temperature deviation occurs between the uppermost and lowermost wafers, prolonging the time for stabilizing temperature
Solution Approach 1:
The heat generating element is divided into multiple independent heating zones (central portion and outer peripheral portion) that can be controlled separately. This segmentation allows different regions of the process vessel to receive customized heating, enabling temperature stabilization across vertically arranged substrates without prolonged deviation between uppermost and lowermost wafers.
Solution Approach 2:
Different heating amounts are applied to different spatial zones within the process vessel. The central portion and outer peripheral portion of the heat generating element provide differentiated heating to address local temperature variations, ensuring uniform temperature distribution across all substrates regardless of their vertical position.
2Temperature
If the heat generating element is configured with end portions not adjacent to outermost turnaround portions, then temperature uniformity is improved, but the device structure becomes more complex
Solution Approach 1:
The heat generating element is divided into distinct functional zones (central and outer peripheral portions) with non-adjacent end portions relative to turnaround portions. This segmentation creates independent heating regions that can be controlled separately, improving temperature uniformity while maintaining a manageable structural complexity through systematic zoning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the time needed to stabilize the temperature of multiple substrates, enhancing productivity by improving temperature uniformity across and between wafers.
Implementation Method 1
a heat generating element divided into at least a central portion and an outer peripheral portion and configured to be capable of adjusting a heating amount of each of the central portion and the outer peripheral portion
Data Source
AI summary
According to the technique of the present disclosure, there is provided a heater comprising a heat generating element divided into at least a central portion and an outer peripheral portion. The heat generating element is configured to be capable of adjusting a heating amount of each of the central portion and the outer peripheral portion. End portions of the outer peripheral portion are not adjacent to outermost turnaround portions of the heat generating element. Further, turnaround portions of the heat generating element are not adjacent to the end portions in a direction outward from a center of the heat generating element in the outer peripheral portion of the heat generating element.