Ceiling Insulating Part with Radial Stress Relief Grooves

Solution Overview

Problem

Existing substrate processing apparatuses, particularly semiconductor manufacturing equipment, face issues with cracks in the ceiling insulating part of the heating device, leading to breakage and potential falling, which affects temperature control and energy efficiency.

Innovation Solution

Incorporating a ceiling insulating part with stress relief grooves that extend from the center to the circumference, without penetrating, to manage thermal expansion and contraction stresses, thereby reducing the likelihood of cracking and breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the ceiling insulating part is made as a single solid structure, then it provides good thermal insulation, but thermal stresses cause cracks and breakage

Engineering Contradiction:

Improvecrack resistanceVSAvoidstructural integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The ceiling insulating part is divided into multiple segments by radial dividing lines that extend from the center to the circumference. These dividing lines create separate sections that can independently expand and contract during heating and cooling cycles, reducing thermal stress concentration and preventing crack propagation while maintaining overall structural integrity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The ceiling insulating part incorporates grooves at specific locations (radially from center to circumference) that create local stress relief zones. These grooves allow controlled deformation in high-stress areas while maintaining insulation properties in other regions, enabling the structure to accommodate thermal expansion without compromising overall strength.

Inventive Principle:

Principle #3Local quality

2Reliability

If the ceiling insulating part is divided into multiple parts, then thermal stresses are reduced, but the structure becomes more complex

Engineering Contradiction:

Improvestress resistanceVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The ceiling insulating part is divided into multiple segments by radial dividing lines that extend from the center to the circumference. These dividing lines create separate sections that can independently expand and contract during heating and cooling cycles, reducing thermal stress concentration and preventing crack propagation while maintaining overall structural integrity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The ceiling insulating part incorporates grooves at specific locations (radially from center to circumference) that create local stress relief zones. These grooves allow controlled deformation in high-stress areas while maintaining insulation properties in other regions, enabling the structure to accommodate thermal expansion without compromising overall strength.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The stress relief grooves effectively mitigate thermal stresses, reducing the occurrence of cracks and breakage in the ceiling insulating part, enhancing the reliability and efficiency of the heating device by maintaining consistent temperature control and energy distribution.

Implementation Method 1

allowing stresses generated at a ceiling insulating part to be relieved at the grooves

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

allowing a stress generated at a ceiling insulating part placed on a sidewall insulating part surrounding the reaction vessel to be relieved at a plurality of grooves disposed in the ceiling insulating part

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentUS8535444B2Substrate processing apparatus, method of manufacturing semiconductor device, and ceiling insulating part

Publication Date: 2013.09.17 KOKUSAI DENKI KK

AI summary

Provided is a substrate processing apparatus. The substrate processing apparatus comprises a reaction vessel configured to process a substrate, and a heating device. The heating device comprises at least one sidewall insulating part surrounding the reaction vessel, a ceiling insulating part placed on the sidewall insulating part and comprising a plurality of stress relief grooves, and a heating element installed at an inner side of the sidewall insulating part.