Integrated Ceiling Light Assembly With Air-Gap LED Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-output LED light fixtures face challenges with heat build-up, which affects efficiency and lifespan, and there is a need for effective heat dissipation and architectural integration in building systems.
Innovation Solution
An integrated ceiling device with a mechanical arrangement that includes a heat dissipating structure and support arms, which effectively conducts heat away from LED light sources and other components, allowing for efficient cooling and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-output LED light sources are used to increase illumination intensity, then lighting performance is improved, but heat build-up increases causing reduced efficiency and lifespan
Solution Approach 1:
The patent extracts the heat-generating LED light sources from the main ceiling device housing by using separate support arms that extend into the ceiling cavity. This physical separation allows the LEDs to be positioned away from heat-sensitive electronic components while maintaining their high-output functionality, thus resolving the contradiction between high illumination intensity and heat management.
Solution Approach 2:
The support arms act as intermediary structures that mechanically connect the ceiling device to the LED light sources while providing thermal isolation. These arms allow heat to be conducted away from the LEDs independently of the main housing, enabling high illumination output without transferring excessive heat to electronic components.
2Temperature
If heat dissipating structures are added to manage thermal output, then temperature control is improved, but device complexity increases
Solution Approach 1:
The support arms serve multiple functions simultaneously: they provide mechanical support for the LED light sources, enable thermal management by conducting heat away from the LEDs, and facilitate electrical connectivity. This multi-functionality reduces the need for separate dedicated heat dissipation structures, thus controlling device complexity while achieving effective temperature management.
3Reliability
If LED light sources are isolated from electronic devices to reduce heat impact, then reliability is improved, but device complexity increases
Solution Approach 1:
The ceiling device is segmented into distinct functional modules: the main housing containing electronic devices and the separate LED light source assemblies mounted on support arms. This segmentation physically isolates heat-generating LEDs from heat-sensitive electronics, improving reliability and LED lifespan while organizing complexity into manageable, modular components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains low junction temperatures, enhances LED lifespan and efficiency, and supports a variety of building system functions by isolating heat sources from electronic devices, enabling smart system capabilities.
Implementation Method 1
a heat dissipating structure and support arms, which effectively conducts heat away from LED light sources
Data Source
AI summary
An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.