Ceiling Part Partitioning for Substrate Temperature Uniformity
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Solution Overview
Problem
In substrate processing apparatuses, convection currents and temperature differences within the buffer area lead to non-uniform in-plane temperature of substrates, making it difficult to maintain uniformity and efficiency in heating and cooling processes.
Innovation Solution
A substrate processing apparatus is designed with a ceiling part that includes a first member with supply holes for cooling media, a second member allowing airflow between the members, and a partition to divide the space into two areas, enhancing airflow balance and cooling efficiency by suppressing convection currents through strategic partitioning and airflow management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling gas is supplied to cool the heating part, then the internal temperature of the furnace can be lowered, but convection currents occur in the buffer area causing non-uniform in-plane temperature of substrates
Solution Approach 1:
The buffer area is divided into multiple independent flow channels (first flow channel, second flow channel, third flow channel, fourth flow channel) with separate cooling gas supply paths. This segmentation prevents convection currents from developing across the entire buffer area, as each channel independently manages cooling flow, thereby maintaining uniform substrate temperature while effectively cooling the furnace interior.
Solution Approach 2:
Different regions of the buffer area are provided with dedicated cooling gas supply paths tailored to their specific cooling requirements. The first and second flow channels serve different zones than the third and fourth flow channels, allowing localized temperature control that prevents convection-induced non-uniformity while achieving effective furnace cooling.
2Loss of energy
If cooling gas flows through the buffer area, then heat can be discharged from the heating part, but convection currents cause local cooling of substrates
Solution Approach 1:
The buffer area is segmented into four distinct flow channels, each with its own cooling gas supply path. This segmentation allows heat to be discharged efficiently through coordinated cooling across all channels while preventing the development of convection currents that would cause local substrate cooling, as each channel's flow is independently controlled.
Solution Approach 2:
Multiple independent cooling gas supply paths act as intermediaries between the cooling gas source and the heating part, distributing cooling function across several controlled channels. This intermediary structure enables effective heat discharge while preventing direct convection currents from affecting substrate temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves in-plane temperature uniformity of substrates, reduces temperature recovery time, lowers energy consumption, and enhances film quality and productivity by effectively cooling the reaction tube and heating part.
Implementation Method 1
a plurality of flow channels installed in the insulating part and allowing an air or a cooling medium to flow
Implementation Method 2
a convection current occurs within a buffer area or a flow channel when the temperature is stable
Data Source
AI summary
A substrate processing apparatus includes a reaction tube processing a substrate, a heating part disposed on an outside of the reaction tube that heats the interior of the reaction tube, an insulating part disposed on an outside of the heating part, a plurality of flow channels installed in the insulating part and allows an air or a cooling medium to flow, and a ceiling part configured to cover an upper surface of the insulating part. The ceiling part includes a first member having a supply hole formed to communicate with the flow channels and to supply the air or cooling medium into the flow channels, and a second member having a space formed between the second member and the first member and allowing the air or the cooling medium to flow therein and having a partition part to partition the space into at least two spaces.