Electrochemical Cell Bonding Structure for Drop-Induced Stress Release
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Solution Overview
Problem
Electrochemical devices, such as batteries, are prone to mechanical abuse leading to short circuits, electrolyte leakage, and fires due to weak bonding and vulnerability to drops, collisions, and vibrations, which compromises their safety performance.
Innovation Solution
An electrochemical device design featuring a housing, electrode assembly, and a first bonding piece with specific bonding strengths (F1/F2 ratio between 5% and 70%) that securely bonds the electrode assembly to the housing, allowing for stress release during mechanical abuse, and includes a separator with high roughness to enhance friction and resistance to mechanical shocks, while a second bonding piece secures the outermost electrode plate to the separator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding strength between the first bonding piece and the housing is increased, then the electrode assembly is more firmly fixed, but the risk of tearing the current collector increases under mechanical stress
Solution Approach 1:
The patent optimizes the bonding strength parameter F1 to a specific range (5-500 N/m) and controls the ratio F1/F2 between 5%-70%, balancing the firm fixation need with the stress release requirement to prevent current collector tearing during mechanical abuse
Solution Approach 2:
The bonding piece is designed to allow dynamic stress release by controlling the bonding strength to enable debonding under excessive stress, transforming a static strong bonding into a dynamic system that can adapt to mechanical shocks and drops
2Strength
If the bonding strength between the first bonding piece and the electrode assembly is increased, then the electrode assembly is more securely bonded, but the bonding piece cannot release stress in time during mechanical abuse
Solution Approach 1:
The patent controls the bonding strength F2 and its ratio to F1 (F1/F2 between 5%-70%) to achieve secure bonding while enabling timely stress release, preventing housing burst open during mechanical abuse
Solution Approach 2:
The bonding system is designed with asymmetric bonding strengths that allow the bonding piece to maintain firm attachment during normal operation but release stress dynamically when subjected to extreme mechanical forces, balancing security with safety
3Ease of manufacture
If the electrode assembly is loosely positioned in the housing, then assembly is easier, but the electrode assembly wobbles during mechanical abuse causing short circuit and safety hazards
Solution Approach 1:
The first bonding piece acts as an intermediary element between the housing and electrode assembly, providing simple yet effective fixation that prevents wobble during mechanical abuse while maintaining ease of assembly through a single bonding component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves anti-drop and safety performance by reducing the risk of wobble, electrolyte leakage, short circuits, and fires, ensuring firm bonding while allowing for stress release and enhancing the electrode assembly's resistance to mechanical shocks.
Implementation Method 1
The separator is of a higher roughness, and therefore, can increase the friction force between the electrode assembly and the first bonding piece, thereby increasing the bonding strength between the electrode assembly and the first bonding piece
Data Source
AI summary
An electrochemical device including a housing, an electrode assembly, and a first bonding piece. The electrode assembly is located in the housing. The first bonding piece bonds the housing and the electrode assembly together. A bonding strength between the first bonding piece and the housing is F1, and a bonding strength between the first bonding piece and the electrode assembly is F2, 5%≤F1/F2≤70%, and 15 N/m≤F1≤500 N/m.