Semiconductor Cell Cleaving for High-Throughput Shingled Solar Modules
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Solution Overview
Problem
The efficiency of solar cell modules is reduced due to the presence of electrical contacts on the front surface, and the manufacturing process for shingled solar cell arrangements is cumbersome, leading to low throughput and yield.
Innovation Solution
An apparatus and method for separating semiconductor cells into high-quality pieces using a holding arrangement and displacement arrangement, which includes holder sections and a mechanism to displace sections relative to each other, facilitating the production of shingled solar cell arrangements by applying mechanical stress to separate the cells efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If solar cells are used with electrical contacts on the front surface, then electrical power can be collected, but the active area is reduced and module power is reduced
Solution Approach 1:
The solar cell is divided into multiple sections, with electrical contacts placed only on specific sections rather than across the entire front surface. This segmentation allows the active area to remain largely uninterrupted while still providing electrical collection points, thereby maintaining module power without sacrificing active area.
2Productivity
If shingled solar cell arrangement is produced with traditional manufacturing processes, then cell pieces can be assembled, but the process is cumbersome and throughput is low
Solution Approach 1:
The manufacturing process performs preliminary actions by pre-defining break lines and pre-separating the solar cell into sections before assembly. This preliminary preparation simplifies the subsequent assembly process, allowing cell pieces to be quickly and easily assembled in a shingled configuration, thereby increasing throughput without adding complexity.
3Manufacturing precision
If solar cells are separated into pieces using traditional methods, then cell sections can be obtained, but the quality and efficiency of separated pieces are compromised
Solution Approach 1:
The patent replaces traditional mechanical cutting or breaking methods with a more sophisticated separation mechanism that uses controlled stress application along predefined break lines. This substitution maintains high manufacturing precision by following exact separation paths while enabling faster separation speeds, thus improving both quality and productivity simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-speed separation of semiconductor cells into high-quality pieces, improving the efficiency and throughput of shingled solar cell module production by reducing the active area affected by electrical contacts and simplifying the assembly process.
Implementation Method 1
a displacement arrangement configured to separate the first section of the semiconductor cell from the second section of the semiconductor cell by displacing the first section relative to the second section
Data Source
AI summary
An apparatus for separating a semiconductor cell, the apparatus includes a holding arrangement comprising a first holder section and a second holder section, the first holder section being configured to support a first section of the semiconductor cell, and the second holder section being configured to support a second section of the semiconductor cell, and a displacement arrangement configured to separate the first section of the semiconductor cell from the second section of the semiconductor cell by displacing the first section relative to the second section.