Cell Module Stepped Through-Hole Adhesive Bonding

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Solution Overview

Problem

Conventional cell module bonding techniques result in adhesive spillage, leading to insufficient bonding strength and potential conduction failures due to excessive adhesive use or unintended bonding with other components.

Innovation Solution

A cell module design featuring a fixing member with a stepped through-hole and an inclined cylindrical cell placement, where the adhesive is supplied into a liquid pocket, preventing spillage by minimizing the interval between the cell and the through-hole wall, ensuring adequate bonding without excess adhesive.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive is injected into the clearance between cylindrical cells and through-hole to bond them, then bonding is achieved, but adhesive spills downward through the fixing member causing insufficient bonding strength and potential conduction failure

Engineering Contradiction:
Improvebonding strengthVSAvoidadhesive spillage
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The through-hole is divided into two distinct parts: an outer part with a first cross-sectional area and an inner part with a second cross-sectional area. This segmentation creates a liquid pocket in the outer part that prevents adhesive spillage while ensuring adequate bonding strength in the inner part.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different parts of the through-hole are given different properties: the outer part has a larger cross-sectional area to contain adhesive (liquid pocket), while the inner part has a smaller cross-sectional area for precise bonding. This local differentiation allows the adhesive to be contained where needed while maintaining bonding effectiveness.

Inventive Principle:
Principle #3Local quality

2Strength

If excessive adhesive is used to compensate for spillage, then bonding strength may be maintained, but conduction failure occurs and unintended bonding with other members happens

Engineering Contradiction:
Improvebonding strengthVSAvoidconduction reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

By segmenting the through-hole into outer and inner parts with different cross-sectional areas, the adhesive is confined to the liquid pocket in the outer part, preventing it from reaching areas where it could cause conduction failures or unintended bonding.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The liquid pocket acts as an intermediary structure that contains the adhesive during the bonding process, preventing direct contact between the adhesive and other members that could cause conduction failures.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If the through-hole has a uniform shape, then manufacturing is simple, but adhesive cannot be contained and spills downward

Engineering Contradiction:
Improvethrough-hole manufacturing simplicityVSAvoidadhesive spillage
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The through-hole is segmented into two parts with different cross-sectional areas, creating a liquid pocket that contains adhesive. This segmentation can be achieved through standard manufacturing processes while effectively preventing spillage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The through-hole has different local properties: the outer part has a larger cross-sectional area for adhesive containment, while the inner part has a smaller area for bonding. This local variation in geometry prevents spillage without significantly complicating manufacturing.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents adhesive spillage, ensuring consistent and strong bonding between cylindrical cells and the fixing member, eliminating conduction failures and allowing for precise adhesive application.

Implementation Method 1

a solidified adhesive disposed in a clearance between a side surface of the cylindrical cell and a wall surface of the through-hole to bond together the cylindrical cell and the fixing member

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS10090493B2Cell module
Publication Date: 2018.10.02 TOYOTA JIDOSHA KK
  • US10090493B2 patent drawing
  • US10090493B2 patent drawing
  • US10090493B2 patent drawing

AI summary

A cell module includes: a cylindrical cell; a fixing member having a through-hole in which one end of the cylindrical cell is held; and a solidified adhesive bonding together the cylindrical cell and the fixing member. The through-hole has an outer part and an inner part. A shape of the outer part is partially enlarged compared with a shape of the inner part so as to form a liquid pocket, and matches the shape of the inner part on the side opposite from the liquid pocket. Relative to the fixing member, the cylindrical cell is held in an inclined state, such that another end of the cylindrical cell is located closer to the liquid pocket side than the one end of the cylindrical cell is.