Electrochemical Cell Interconnect Cell Nest for Leak-Resistant Sealing

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Solution Overview

Problem

Powder metallurgy interconnects for solid oxide electrochemical cell stacks are expensive to manufacture.

Innovation Solution

The interconnects include reactant holes, reactant and air fields with channels and ribs, peripheral and recess seal surfaces, and nest sidewalls that define a cell nest to receive an electrochemical cell, with a method of applying seal materials and a compliant contact layer to enhance sealing and reduce reactant leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If powder metallurgy processes are used to manufacture interconnects, then the interconnects can be produced with complex geometries including reactant holes, channels, ribs, seal surfaces, and cell nest structures, but the manufacturing cost becomes expensive

Engineering Contradiction:

Improvemanufacturing costVSAvoidsealing performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The interconnect is divided into multiple functional surfaces (peripheral seal surface, recess seal surfaces, nest sidewalls, ring seal surfaces) that work together to create a comprehensive sealing system. This segmentation allows each surface to be optimized for its specific sealing function while using cost-effective manufacturing processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The seal surfaces and cell nest structures are pre-formed during interconnect manufacturing, and seal materials are pre-applied to these surfaces before cell assembly. This preliminary preparation ensures proper sealing without requiring expensive post-assembly adjustments or complex manufacturing processes.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If conventional interconnect designs without recess seal surfaces and nest sidewalls are used, then the manufacturing process is simpler, but reactant leakage occurs and sealing is insufficient

Engineering Contradiction:

Improvesealing performanceVSAvoidinterconnect structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Different regions of the interconnect are given different geometric qualities - peripheral seal surfaces for outer sealing, recess seal surfaces for intermediate sealing, and nest sidewalls for cell positioning and sealing. This local differentiation of surface properties ensures comprehensive sealing without requiring complex structures throughout the entire interconnect.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The recess seal surfaces and nest sidewalls act as intermediary sealing elements between the peripheral seal surface and the cell contact points. These intermediate structures provide additional sealing barriers that prevent reactant leakage without requiring a complete redesign of the entire interconnect architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If seal materials are not applied to recess seal surfaces and nest sidewalls, then the assembly process is faster and simpler, but sealing is insufficient and reactant leakage occurs

Engineering Contradiction:

Improvesealing performanceVSAvoidassembly speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Seal materials are pre-applied to the recess seal surfaces and nest sidewalls during the interconnect manufacturing process, before final assembly. This preliminary sealing preparation ensures that when cells are installed, the sealing function is already in place, reducing assembly complexity and maintaining high productivity while ensuring reliable sealing.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20260066312A1Interconnect including cell nest and method of assembling an electrochemical cell stack including the interconnect

Publication Date: 2026.03.05 BLOOM ENERGY CORP

AI summary

An interconnect for an electrochemical cell stack includes reactant holes that extend through the interconnect, and a reactant side including a reactant field containing reactant channels and reactant ribs that extend between the reactant holes, a peripheral seal surface that surrounds the reactant field and the reactant holes, recess seal surfaces disposed inside of the peripheral seal surface on opposing sides of the reactant field and recessed relative to the peripheral seal surface, and nest sidewalls that connect the recess seal surfaces to the peripheral seal surface. The nest sidewalls extend substantially perpendicular to the peripheral seal surface and to the recess seal surfaces. The nest sidewalls, the recess seal surfaces, and tops of the reactant ribs at least partially define a cell nest configured to receive an electrochemical cell. An air side includes an air field disposed between the reactant holes, and ring seal surfaces disposed around the reactant holes.