Electrochemical Cell Packaging Laminate for Short-Circuit Insulation
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Solution Overview
Problem
Conventional electrochemical cell packaging materials face issues with short-circuiting due to electrode active material peeling or scattering, metal foreign matter entering the thermally adhesive layer, and electrode tab burrs penetrating the barrier layer, leading to electrical insulation deterioration.
Innovation Solution
The use of alumina particles and modified epoxy resin in a chemical conversion treatment layer provides electrical insulation and resistance to heat and pressure, preventing foreign matter from reaching the barrier layer and thus preventing short-circuiting, while metal oxide microparticles with specific particle diameters enhance heat resistance and insulation, further preventing electrical insulation deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat-sealing is performed during cell manufacturing, then the packaging material is sealed to enclose the electrochemical cell module, but electrode active material or metal foreign matter bites into the thermally adhesive layer causing short-circuiting
Solution Approach 1:
The patent introduces a protective layer comprising alumina particles and modified epoxy resin between the thermally adhesive layer and the barrier layer. This intermediary layer acts as a mediator that prevents electrode active material and metal foreign matter from directly contacting and causing short-circuits in the thermally adhesive layer during heat-sealing, while still allowing the heat-sealing function to be performed.
Solution Approach 2:
The protective layer is formed as a composite material combining alumina particles (providing heat resistance and electrical insulation) with modified epoxy resin (providing structural integrity and adhesion). This composite structure prevents foreign matter penetration while maintaining the necessary thermal and mechanical properties for heat-sealing application.
2Productivity
If the thermally adhesive layer is made thin to improve sealing efficiency, then heat-sealing is more efficient, but the layer becomes more susceptible to penetration by foreign matter
Solution Approach 1:
The protective layer with alumina particles and modified epoxy resin serves as an additional intermediary barrier that compensates for the reduced thickness of the thermally adhesive layer. This allows the thermally adhesive layer to remain thin for efficient heat-sealing while the protective layer provides the necessary protection against foreign matter penetration.
Solution Approach 2:
The protective layer is specifically positioned at the inner surface of the packaging material where foreign matter penetration risk is highest. This localized quality enhancement provides targeted protection exactly where needed, allowing the rest of the structure to maintain optimal thinness for heat-sealing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short-circuiting and electrical insulation deterioration by using chemical conversion treatment layers and insulating layers with specific metal oxide microparticles, ensuring the integrity of the packaging material during heat-sealing and use.
Implementation Method 1
the alumina particles and modified epoxy resin contained in the chemical conversion treatment layer have electrical insulation
Implementation Method 2
unlikely to melt or yield under heat and pressure during heat-sealing
Implementation Method 3
metal oxide microparticles...excellent in heat resistance
Implementation Method 4
highly insulating
Implementation Method 5
heat-sealing them together at a thermally adhesive portion
Data Source
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AI summary
There is provided an electrochemical cell packaging material comprising, as layers laminated together, at least: a base material layer (112) formed of a resin film; a thermally adhesive layer (116) arranged as an innermost layer and formed of a thermally adhesive resin; and a barrier layer (114) arranged between the base material layer and the thermally adhesive layer (116) and formed of a metal foil, wherein an insulating layer (117) formed by stacking a plurality of metal oxide microparticles (111), with the metal oxide microparticles (111) partly melted to bond to the barrier layer (114), is provided on a surface of the barrier layer (114) facing the thermally adhesive layer (116).