Cement Encapsulation for Semiconductor Dies Without Warpage
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Solution Overview
Problem
The existing manufacturing processes for encapsulating semiconductor dies and packages often result in warpage and die shift phenomena due to thermal hardening and equipping with insulating means and electrical connections, leading to scrap formation and improper joining to metal contacts.
Innovation Solution
The use of an aqueous hydraulic hardening inorganic cement preparation as the encapsulation agent, which sets in the presence of water, providing a stable and non-warpage inducing encapsulation that prevents die shift and allows for proper electrical contacting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal hardening is used to harden the encapsulation agent, then the encapsulation material hardens and forms a protective structure, but warpage phenomena and die shift occur leading to scrap formation
Solution Approach 1:
The patent changes the hardening mechanism from thermal to hydraulic by using an aqueous hydraulic hardening inorganic cement preparation instead of thermally hardening organic molding compounds. This parameter change in the hardening process eliminates thermal expansion and contraction that cause warpage and die shift, while still achieving proper hardening of the encapsulation material through chemical reaction with water
Solution Approach 2:
The patent replaces the thermal field (heat-based hardening) with a chemical field (hydraulic hardening). By substituting thermal energy with chemical reaction energy, the process avoids thermal stresses that cause warpage and positioning errors, while maintaining the hardening function through inorganic cement chemistry
2Reliability
If equipping semiconductor dies with electrically insulating means and electrical interconnection is performed, then electrical functionality is achieved, but warpage and die shift occur causing incapability to join to metal contacts
Solution Approach 1:
The patent changes the encapsulation material from organic polymer to hydraulic hardened inorganic cement composition, which fundamentally alters the hardening mechanism from thermal to hydraulic. This parameter change ensures dimensional stability during subsequent electrical interconnection processes, preventing warpage that would otherwise cause misalignment with metal contacts
3Ease of manufacture
If conventional organic molding compound is used as encapsulation agent, then encapsulation is achieved, but chemical and fire hazards are present
Solution Approach 1:
The patent changes the chemical composition of the encapsulation agent from organic polymer to inorganic cement-based material. This fundamental material parameter change eliminates flammability and reduces chemical hazards associated with organic compounds, while maintaining encapsulation functionality through the hydraulic hardening mechanism
Solution Approach 2:
The patent uses water as the hardening agent instead of complex chemical systems. Water is safe, non-flammable, and eliminates the need for hazardous chemicals typically required for hardening organic molding compounds, thereby removing fire and chemical hazards from the process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces scrap formation by preventing warpage and enhancing thermal resistance and safety, while allowing for proper electrical connections and reducing chemical and fire hazards.
Implementation Method 1
an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent which sets in the presence of water
Data Source
AI summary
A process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages or for the manufacture of an encapsulation of semiconductor dies and/or of semiconductor packages comprising the steps: (1) assembling a multitude of bare semiconductor dies on a temporary carrier, and (2) encapsulating the assembled bare semiconductor dies, characterized in that an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent in step (2).