Central Exhaust Chamber Layout for Parallel Substrate Processing
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Solution Overview
Problem
Current methods for processing semiconductor substrates involve numerous transfers between process chambers, leading to reduced throughput, increased costs, and a larger footprint due to the need for multiple chambers and transfer robots.
Innovation Solution
A processing system with a centralized exhaust inlet and multiple process chambers surrounding it, where a transfer robot can simultaneously move substrates between chambers, and internal ports allow for efficient repositioning of substrates within the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are transferred sequentially between multiple process chambers, then each process can be performed in a dedicated chamber, but the throughput decreases and processing time increases
Solution Approach 1:
Multiple process chambers are merged into a single integrated chamber where multiple substrates can be processed simultaneously. The chamber contains multiple substrate supports arranged to allow parallel processing of multiple substrates through different process zones, eliminating the need for sequential transfers between separate chambers.
Solution Approach 2:
The system transitions from a sequential one-dimensional process flow to a parallel three-dimensional arrangement where multiple substrates are processed simultaneously at different heights and positions within the same chamber, enabled by vertical substrate supports and multi-level processing zones.
2Adaptability or versatility
If multiple separate process chambers are used for different processes, then each process can be optimized independently, but the system footprint increases
Solution Approach 1:
Multiple process chambers are consolidated into a single chamber body that contains multiple substrate supports and process zones. Different processes can be performed in different zones of the same chamber, reducing the overall footprint while maintaining process versatility through spatial separation of process zones within the unified chamber structure.
3Ease of operation
If transfer robots are used to move substrates between chambers, then substrates can be transferred between different process zones, but the device complexity and operational costs increase
Solution Approach 1:
The transfer robot system is extracted and eliminated by redesigning the chamber configuration. Multiple substrate supports are positioned within direct access of a single chamber, allowing substrates to be loaded once and processed through multiple zones without requiring robotic transfer mechanisms between separate chambers.
4Adaptability or versatility
If numerous transfers between chambers are performed, then multiple processes can be applied to substrates, but the processing time and operational costs increase
Solution Approach 1:
The system enables continuous processing by maintaining all substrate supports and process zones within a single chamber environment. Substrates can move continuously through different process zones without interruption for chamber transfer, maintaining vacuum or controlled atmosphere conditions throughout the entire processing sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances throughput by minimizing transfer time, reduces the system's footprint by integrating multiple processes around a central exhaust, and lowers operational costs through optimized substrate handling and processing.
Implementation Method 1
a plurality of lamps positioned over each substrate support
Implementation Method 2
an exhaust inlet; two or more process chambers surrounding the exhaust inlet
Data Source
AI summary
A processing tool is provided including an exhaust inlet; two or more process chambers surrounding the exhaust inlet, each process chamber including: a chamber body enclosing an interior volume, the chamber body including a plurality of sidewalls that include one or more outer walls and one or more inner walls; one or more substrate supports disposed in the interior volume; a plurality of lamps positioned over each substrate support; a window positioned between the plurality of lamps and the substrate support; and a gas inlet that is located closer to one of the one or more outer walls than the gas inlet is to each of the one or more inner walls.