Ceramic Member With Aluminum Conductive Layer
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Solution Overview
Problem
The use of copper in composite ceramic materials for electrostatic chucks and other applications requires long and costly degreasing and sintering processes due to its low melting point, leading to increased electrical resistance and reduced thermal conductivity.
Innovation Solution
Incorporating bulk aluminum or aluminum alloy conductive members into a ceramic sintered body, manufactured by layering green sheets with metal films and sintering in an oxidizing atmosphere, which reduces electrical resistance and increases thermal conductivity without the need for prolonged degreasing and sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used as conductive material in ceramic composite, then electrical resistance is reduced, but degreasing and sintering time must be extended due to copper's low melting point, resulting in increased manufacturing cost
Solution Approach 1:
The patent changes the material parameter from copper to aluminum or aluminum alloy, which has a higher melting point than copper. This parameter change allows the material to withstand standard sintering temperatures without requiring extended processing time, thereby reducing manufacturing cost while maintaining low electrical resistance and providing high thermal conductivity.
2Reliability
If copper is used as conductive material, then electrical resistance is reduced, but manufacturing cost increases due to prolonged degreasing and sintering processes
Solution Approach 1:
The patent changes the material parameter from copper to aluminum or aluminum alloy, which has a higher melting point. This allows the material to be processed using standard sintering procedures without requiring extended processing time or specialized equipment, thereby reducing manufacturing cost while maintaining low electrical resistance.
Solution Approach 2:
The patent employs aluminum or aluminum alloy, which are more cost-effective materials compared to copper. These materials can be processed more efficiently and are generally less expensive, providing a cost-effective solution for manufacturing ceramic composites with conductive properties.
3Reliability
If copper is used as conductive material, then electrical resistance is reduced, but thermal conductivity decreases due to prolonged heat exposure during manufacturing
Solution Approach 1:
The patent changes the material parameter from copper to aluminum or aluminum alloy, which inherently possesses higher thermal conductivity. This material substitution ensures that the ceramic composite maintains excellent thermal conductivity even after prolonged heat exposure during manufacturing, while still providing low electrical resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach lowers electrical resistivity and enhances thermal conductivity while maintaining a high relative density of the sintered body, preventing internal stress and reducing manufacturing costs.
Implementation Method 1
sintering the first green sheet and the second green sheet at a temperature greater than or equal to a melting point of the metal film
Data Source
AI summary
A ceramic member includes: a ceramic sintered body; and a conductive member of aluminum or an aluminum alloy provided in the sintered body.