Ceramic Antenna Via Structure for Simpler Sidewall Metallization

The patent extracts the essential function of vertical metal sidewalls (providing radiation performance) and removes the complex manufacturing process (multiple metal plating steps). Instead, conductive vias are used to achieve the same electromagnetic radiation effect through a simpler single-step plating process, thereby eliminating manufacturing complexity while preserving radiation performance.

The patent changes the structural parameter from continuous vertical sidewalls to discrete conductive vias. This parameter change maintains the electromagnetic radiation function while significantly simplifying the manufacturing process, as the via structure can be created in a single plating step rather than requiring multiple sequential plating operations.

The patent removes the expensive multiple metal plating steps while extracting only the essential radiation function. The conductive via approach achieves the same electromagnetic performance with a single plating step, directly reducing production cost while maintaining radiation performance.

The patent employs a simpler, more cost-effective structure (conductive vias) that can be manufactured in a single plating step, replacing the expensive and time-consuming vertical sidewall structure. This approach uses a more economical manufacturing method that reduces both material and process costs.

The patent extracts the radiation function from the complex vertical sidewall structure and implements it through simple conductive vias. This simplification enables more efficient mass production by eliminating multiple sequential plating steps, thereby improving productivity while maintaining radiation performance.

The patent changes the structural parameter from continuous sidewalls to discrete vias, which fundamentally simplifies the manufacturing process. This parameter change enables streamlined mass production with fewer process steps, directly improving productivity and manufacturing efficiency.