Ceramic Back Cover Heat Dissipation for Handheld Devices
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Solution Overview
Problem
Handheld electronic devices face challenges in heat dissipation due to their miniaturized size and materials, leading to overheating issues that shorten component lifetimes and interfere with antenna signal reception, especially in devices with aluminum/magnesium alloy cases.
Innovation Solution
A case heat dissipation unit featuring a back cover with a ceramic layer and a titanium or stainless steel metal layer positioned over heat sources, which absorbs and transfers heat to the external environment for dissipation, while maintaining antenna compatibility and impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If aluminum/magnesium alloy is used for the case, then appearance and strength are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent applies composite materials by combining aluminum/magnesium alloy with ceramic materials in the case structure. The ceramic material is integrated into the case to provide heat dissipation pathways while maintaining the structural strength and appearance benefits of the aluminum/magnesium alloy base material.
2Strength
If aluminum/magnesium alloy is used for the case, then appearance is improved, but antenna signal reception deteriorates
Solution Approach 1:
The case is segmented into different material regions: aluminum/magnesium alloy portions for structural strength and appearance, and ceramic portions for heat dissipation and antenna signal compatibility. This segmentation allows the antenna to be positioned in areas with favorable signal characteristics while maintaining overall case integrity.
Solution Approach 2:
Different regions of the case have different material properties tailored to local requirements: aluminum/magnesium alloy in areas requiring strength and aesthetic appearance, and ceramic in areas requiring heat dissipation and antenna signal compatibility. This local quality optimization resolves the contradiction between case strength and antenna performance.
3Volume of moving object
If device volume is minimized, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
Heat dissipation pathways are concentrated in specific local regions where ceramic material is integrated into the case structure. This allows efficient heat dissipation from critical components without requiring the entire case to be large, thus maintaining compact device volume while improving heat dissipation capability in targeted areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from handheld electronic devices, prolonging their lifespan and ensuring antenna signal integrity without compromising the device's layout or appearance.
Implementation Method 1
The titanium metal layer or the stainless steel metal layer serves to absorb the heat generated by the heat source and transfer the heat to the ceramic layer
Implementation Method 2
Then the heat is transferred to the external environment to heat-exchange with the external environment for dissipating the heat
Data Source
AI summary
A case heat dissipation unit of handheld electronic device includes a back cover including a ceramic layer. A titanium metal layer or a stainless steel metal layer is disposed on the ceramic layer in a position corresponding to at least one heat source. The ceramic layer is an outer surface of the handheld electronic device and exposed to an external environment. The titanium metal layer or the stainless steel metal layer faces a receiving space of the handheld electronic device in contact with the heat source in the receiving space. The titanium metal layer or the stainless steel metal layer serves to absorb the heat generated by the heat source and transfer the heat to the ceramic layer for dissipating the heat.