Ceramic Back Cover Wireless Charging Integration

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Solution Overview

Problem

Existing portable electronic devices face challenges with thick wireless charging coils due to wire wrapping and metal back covers that affect signal transmission and increase manufacturing complexity and costs, while also having unsatisfactory wireless charging efficiency.

Innovation Solution

A ceramic back cover integrates a wireless charging RX coil with grooves for electrode extensions, eliminating the need for wire pressing and combining with a main antenna and NFC antenna, using zirconium or aluminum oxide ceramics with electroplating and silver ink firing for efficient heat dissipation and signal integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a wireless charging coil and magnetic plate are adhered to be fixed on a back cover, then wireless charging function is achieved, but inner space is occupied and product cannot be miniaturized and thinned

Engineering Contradiction:
Improveproduct sizeVSAvoidwireless charging efficiency
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent integrates the wireless charging RX coil directly into the ceramic back cover by forming conductive patterns (traces) on the inner surface of the back cover, eliminating the need for separate coil components and magnetic plates. This merging of functions allows the back cover to serve both structural and wireless charging purposes, reducing overall device thickness while maintaining charging efficiency

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The ceramic back cover is designed to perform multiple functions: it serves as the structural back cover, the antenna substrate, and the wireless charging receiver. The conductive patterns formed on the back cover enable it to function as both the structural element and the electromagnetic receiving element, achieving multi-functionality that reduces component count and device thickness

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Length of moving object

If wire of the coil is wrapped and leading-out end is pressed on the coil, then coil connection is achieved, but thickness of the coil is doubled

Engineering Contradiction:
Improvecoil thicknessVSAvoidcoil manufacturing complexity
Core Design Contradiction:
Length of moving objectVSEase of manufacture

Solution Approach 1:

The patent replaces the traditional mechanical wire-wrapping and pressing method with a ceramic-based conductive pattern formation process. Conductive traces are directly formed on the inner surface of the ceramic back cover through printing or sintering techniques, eliminating the need for separate wire connections and pressing operations. This substitution dramatically reduces coil thickness and simplifies the manufacturing process

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the fundamental parameter of how electrical connections are made in the coil structure. Instead of using thick pressed wire connections, the patent uses thin conductive traces formed by ceramic printing technology, changing the connection method from mechanical pressing to ceramic-based conductive patterning, thereby reducing thickness while maintaining electrical functionality

Inventive Principle:
Principle #35Parameter changes

3Shape

If metal frame and metal back cover are used for fashion, then aesthetic appearance is improved, but signal transmission is affected

Engineering Contradiction:
Improveaesthetic appearanceVSAvoidsignal transmission
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The patent uses ceramic material for the back cover instead of traditional metal materials. Ceramic provides both the desired aesthetic appearance (can be made to look like metal or have unique textures) and the critical advantage of being non-conductive, which allows signal transmission without interference. This material substitution resolves the contradiction between appearance and signal transmission

Inventive Principle:
Principle #40Composite materials

4Length of moving object

If LDS antenna is fixed on plastic support by using screws, then antenna mounting is achieved, but thickness of the product is increased

Engineering Contradiction:
Improveproduct thicknessVSAvoidmanufacturing process
Core Design Contradiction:
Length of moving objectVSDevice complexity

Solution Approach 1:

The patent integrates the antenna directly into the ceramic back cover by forming conductive patterns on the back cover surface, eliminating the need for separate plastic supports and screw mounting structures. The back cover itself becomes the antenna substrate, merging the structural support function with the antenna function, thereby reducing thickness and simplifying the manufacturing process

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces device thickness, enhances wireless charging efficiency, simplifies manufacturing, and ensures signal transmission without the need for segmented metal frames, offering higher quality and lower costs.

Implementation Method 1

using zirconium or aluminum oxide ceramics with electroplating and silver ink firing for efficient heat dissipation

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

using zirconium or aluminum oxide ceramics with electroplating and silver ink firing

Methodology Applied
Scientific EffectElectroplating: Electroplating

Implementation Method 3

a wireless charging RX coil is disposed on an inner surface of the ceramic back cover

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS10224984B1Electronic device and ceramic back cover used in electronic device
Publication Date: 2019.03.05 SHENZHEN SUNLORD ELECTRONICS
  • US10224984B1 patent drawing
  • US10224984B1 patent drawing
  • US10224984B1 patent drawing

AI summary

Disclosed is a ceramic back cover used in an electronic device and an electronic device having the ceramic back cover. A wireless charging RX coil is disposed on an inner surface of the ceramic back cover, a groove used for disposing the wireless charging RX coil is in an intermediate region of the inner surface of the ceramic back cover, and at least two wireless charging RX electrode grooves that extend outward separately from an intermediate region of the groove and a marginal region of the groove are formed on the inner surface of the ceramic back cover. Electrodes formed in the at least two wireless charging RX electrode grooves are used as leading-out ends of the wireless charging RX coil disposed in the groove, and two ends of the wireless charging RX coil are welded at the leading-out ends.