Ceramic Electronic Component Band Electrodes for Stronger Mounting
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Solution Overview
Problem
Multilayer ceramic capacitors with a bottom electrode structure face reduced soldering areas, leading to decreased adhesion strength and a higher risk of the chip falling off when mounted on a substrate due to stress concentration at notch points.
Innovation Solution
Incorporating a plurality of insulating members between the band electrodes on the ceramic electronic component's surface, which disperses stress concentration and improves adhesion strength by reducing the effective stress at notch points during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a bottom electrode structure is used to increase effective volume and reduce mounting area, then high density is achieved, but soldering area is reduced and adhesion strength decreases
Solution Approach 1:
The patent divides the continuous band electrode structure into segmented sections by introducing insulating members at specific intervals. This segmentation creates multiple discrete bonding zones along the band electrode, distributing the mechanical stress and improving overall adhesion strength while maintaining the compact bottom electrode configuration for high density.
2Reliability
If band electrodes are disposed on the first surface to enable mounting, then electrical connection is achieved, but stress concentrates at notch points causing chip to fall off
Solution Approach 1:
The patent introduces insulating members as intermediary elements positioned between the band electrode and the ceramic body at notch points. These insulating members act as stress distributors, preventing direct stress concentration at the vulnerable notch points while maintaining the electrical connection functionality of the band electrode structure.
Solution Approach 2:
The insulating members are pre-positioned at the notch points before mounting, providing beforehand cushioning against stress concentration. This preventive measure distributes the mechanical load before it can concentrate at the vulnerable notch points, preventing chip detachment during the mounting process.
3Strength
If insulating members are added to disperse stress concentration, then adhesion strength is improved, but device complexity increases
Solution Approach 1:
The patent applies insulating members only at specific critical locations (notch points) rather than uniformly throughout the entire band electrode structure. This localized application provides stress distribution benefits where most needed while minimizing the overall increase in device complexity and material usage.
Data Source
AI summary
A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first band electrode disposed on a portion of the first surface adjacent to the third surface; a second band electrode disposed on another portion of the first surface adjacent to the fourth surface; and insulating members disposed between the first and second band electrodes disposed on the first surface and spaced apart from each other, wherein the first surface is exposed through a space between the plurality of insulating members.