Ceramic Component Barrier Layer for Mark Crack and Liquid Intrusion
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Solution Overview
Problem
In ceramic electronic components, the diffusion of identification marks into the element body can lead to cracks, detachment, and liquid intrusion due to differences in material composition and sinterability between the identification mark and the element body, resulting in suboptimal sintering conditions.
Innovation Solution
A ceramic electronic component design featuring a barrier layer with a higher glass material proportion than the element body, interposed between the element body and the identification mark, to prevent diffusion and absorb stress, while ensuring the identification mark is sintered more densely to reduce liquid entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the identification mark uses a different composition ratio from the element body to ensure visibility, then the identification mark becomes visible, but diffusion occurs between the identification mark and element body causing cracks and detachment
Solution Approach 1:
A barrier layer is introduced between the identification mark and the element body. This barrier layer has a glass material proportion of 20-40%, which is higher than the element body's glass material proportion of 10-30%. The barrier layer acts as an intermediary that prevents direct diffusion between the identification mark and element body, while its intermediate glass content allows it to bridge the compositional gap and reduce thermal expansion mismatch.
2Ease of manufacture
If the element body is sintered at the optimum temperature for the element body, then the element body achieves good sinterability, but the identification mark may be insufficiently sintered or excessively sintered
Solution Approach 1:
The barrier layer's glass material proportion is specifically adjusted to 20-40%, creating an intermediate composition between the element body (10-30% glass) and the identification mark (typically higher glass content for visibility). This parameter adjustment allows the barrier layer to have intermediate sintering characteristics, enabling all three layers to be sintered together at a unified temperature that satisfies both the element body's sinterability requirements and the identification mark's densification needs.
3Reliability
If the identification mark is sintered more densely to prevent liquid entry, then liquid intrusion is reduced, but stress acts on the element body causing cracks
Solution Approach 1:
The barrier layer is designed with localized intermediate glass content (20-40%) that is higher than the element body but can be optimized independently. This allows the barrier layer to achieve higher density and better liquid resistance locally at the identification mark interface, while the element body maintains its original mechanical properties. The barrier layer absorbs the densification stress that would otherwise transfer to the element body.
4Reliability
If a barrier layer with higher glass material proportion is introduced, then diffusion is suppressed and adhesion is enhanced, but the device structure becomes more complex
Solution Approach 1:
The barrier layer performs multiple functions simultaneously: (1) it acts as a diffusion barrier between the identification mark and element body, (2) it serves as an adhesive layer enhancing bonding between layers, (3) it functions as a stress buffer absorbing thermal expansion mismatch, and (4) it provides a compositional gradient transitioning from the element body to the identification mark. By consolidating these multiple functions into a single layer, the structural complexity is minimized while achieving comprehensive performance improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses breakage of the identification mark and element body, reduces liquid intrusion, and enhances adhesion and visibility of the identification mark, thereby improving the reliability and durability of the ceramic electronic component.
Implementation Method 1
diffusion from the identification mark to the element body occurs
Implementation Method 2
a proportion of the glass material included in the barrier layer is higher than a proportion of the glass material included in the element body
Implementation Method 3
the number of voids in the element body increases
Data Source
AI summary
To provide ceramic electronic component capable of suppressing breakage of identification mark and element body and intrusion of liquid into element body. Ceramic electronic component includes element body including ceramic as main material, barrier layer formed on surface of element body and including ceramic as main material, and identification mark formed on surface of barrier layer. Element body, barrier layer, and identification mark include glass material. Proportion of glass material included in barrier layer is higher than proportion of glass material included in element body.