High Reflectivity Ceramic Base Board for Mini-LED Circuit Boards
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Solution Overview
Problem
The light reflectivity mismatch between the base board layer and the solder mask on mini-LED backlight circuit boards affects the light emitting efficiency and uniformity of LED lamps, as the base board layer has low light reflectivity compared to the outer solder mask.
Innovation Solution
A method involving a laminated structure with a high light reflectivity base board embedded in the circuit board, where the base board is pressed between two wiring base boards to create a uniform light reflectivity surface, and a solder mask with high light reflectivity is applied to cover the conductor layers, ensuring consistent light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a solder mask with high light reflectivity is applied to cover the circuit board surface, then the light emitting efficiency of the LED lamp is improved, but the light reflectivity mismatch between the base board layer and the solder mask causes non-uniform light emission
Solution Approach 1:
The patent applies different light reflectivity treatments to different regions of the circuit board. Specifically, the base board layer in the LED mounting area is treated to have high light reflectivity matching the solder mask, while other areas maintain their original properties. This local differentiation resolves the uniformity issue while preserving overall light emitting efficiency.
Solution Approach 2:
The patent makes the light reflectivity properties homogeneous across the entire circuit board surface by treating the base board layer to match the solder mask's high reflectivity. This creates a uniform optical environment that eliminates the mismatch problem and ensures consistent light emission across all LED mounting areas.
2Ease of manufacture
If the base board layer is left with low light reflectivity to maintain manufacturing simplicity, then the production process remains simple, but the light emitting efficiency and uniformity of the LED lamp deteriorates
Solution Approach 1:
Instead of treating the entire base board uniformly, the patent applies reflectivity enhancement only to specific regions where LEDs are mounted. This localized approach maintains manufacturing simplicity while significantly improving light emitting efficiency in the critical areas.
Solution Approach 2:
The patent changes the light reflectivity parameter of the base board layer in the LED mounting area to match the solder mask. This parameter modification is achieved through cost-effective methods such as applying reflective coatings or using high-reflectivity materials in specific regions, thereby improving efficiency without substantially increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the light emitting efficiency and uniformity of mini-LED backlights by matching the light reflectivity of the base board with the solder mask, improving the overall performance of the LED lamps.
Implementation Method 1
a base board layer in an area for mounting the LED lamp has a low light reflectivity which is inconsistent with the light reflectivity of the outer solder mask
Data Source
AI summary
A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.