Ceramic Baseplate Non-Square Channel Corners
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Solution Overview
Problem
Substrate processing systems face challenges in maintaining the reliability and longevity of ceramic baseplates due to the risk of channel breakage caused by rectangular corners, which can lead to temperature control issues and substrate damage during processing.
Innovation Solution
The use of ceramic baseplates with chamfered, staired, or rounded internal corners for coolant and gas channels, which are formed by multiple ceramic layers, enhances the structural integrity and reduces the risk of breakage, thereby increasing the reliability and lifetime of the substrate support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rectangular channels with sharp corners are used in ceramic baseplates, then the manufacturing process is simple, but the channels are prone to breakage and structural failure
Solution Approach 1:
The patent applies curvature by replacing sharp rectangular corners with rounded corners in the channel cross-section. This curvature eliminates stress concentration points that would otherwise exist at sharp corners, thereby preventing channel breakage while maintaining manufacturing feasibility through standard ceramic processing techniques.
Solution Approach 2:
The patent introduces asymmetry by modifying the channel geometry from a symmetric rectangular shape to an asymmetric shape with rounded corners. This asymmetric design with chamfered or rounded features redistributes stress more evenly throughout the channel structure, enhancing reliability without significantly complicating the manufacturing process.
2Device complexity
If rectangular channels with sharp corners are used, then the design is simple, but the baseplate reliability and lifetime are reduced due to breakage risk
Solution Approach 1:
By rounding the corners of the channels, the patent eliminates sharp geometric discontinuities that act as stress concentration points. This curvature modification significantly reduces the risk of channel breakage during operation, thereby extending the operational lifetime of the ceramic baseplate while adding minimal geometric complexity.
Solution Approach 2:
The patent applies beforehand cushioning by incorporating chamfered or rounded corner features during the manufacturing stage. These geometric modifications pre-compensate for potential stress concentrations that would otherwise develop during thermal cycling and operational use, preventing breakage before it can occur and extending baseplate lifetime.
3Ease of manufacture
If rectangular channels are used, then the manufacturing process is straightforward, but temperature control reliability is compromised due to channel breakage
Solution Approach 1:
The rounded corner geometry eliminates stress concentrations that lead to channel breakage. By maintaining intact coolant and gas channels, the patent ensures reliable temperature control of the substrate throughout operation, while the manufacturing process remains straightforward using conventional ceramic fabrication methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-rectangular channel shapes minimize the risk of breakage, ensuring reliable temperature control and extended lifespan of the substrate support, thus improving the overall performance and durability of substrate processing systems.
Implementation Method 1
Coolant can be circulated through one or more coolant channels in the substrate support using valves to heat and/or cool the substrate and the substrate support
Implementation Method 2
Heaters can be arranged in the substrate support assembly, and the power supplied to the heaters can be controlled to control the temperature of a substrate on the substrate support
Implementation Method 3
A temperature of a substrate (e.g., a semiconductor wafer) in a processing chamber can be controlled. Heaters can be arranged in the substrate support assembly, and the power supplied to the heaters can be controlled to control the temperature of a substrate on the substrate support
Data Source
AI summary
A substrate support includes: a first plate configured to support a substrate; and a second plate that is connected to the first plate. The second plate includes at least one of: an internal coolant channel configured to receive coolant; and an internal gas channel configured to receive gas. The at least one of the internal coolant channel and the internal gas channel includes one of: chamfered internal corners; and staired internal corners.


