Ceramic Circuit Board Copper Pillar Structure for Thermal Cycling Reliability
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Solution Overview
Problem
Conventional ceramic circuit boards lack sufficient reliability and are prone to cracking after multiple temperature cycling tests.
Innovation Solution
A high reliability ceramic circuit board design featuring a ceramic substrate with a copper pillar structure and direct plated copper (DPC) structures, including a sputtered, chemical plated, and electroplated copper layers, enhances structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional ceramic circuit board structure is used, then the manufacturing process is simple, but the reliability is poor and the board cracks easily after temperature cycling tests
Solution Approach 1:
The patent applies composite materials by creating a multi-layer copper structure consisting of printed copper layers, direct plated copper (DPC) structures, and copper pillar structures. This composite copper architecture combines different copper formation techniques to achieve superior mechanical strength and thermal stability, preventing ceramic substrate cracking during temperature cycling while maintaining manufacturing feasibility
Solution Approach 2:
The patent segments the copper structure into multiple functional components: printed copper layers for basic conductivity, DPC structures for enhanced bonding, and copper pillars for mechanical support. This segmentation allows each component to perform its specific function optimally, with the DPC structures serving as intermediate bonding layers that bridge the printed copper and the ceramic substrate, thereby improving overall reliability
2Reliability
If direct plated copper structures with multiple layers are formed, then the resistance to cracking improves, but the manufacturing process complexity increases
Solution Approach 1:
The patent employs preliminary action by first forming the printed copper layers and copper pillar structures before applying the direct plated copper structures. This sequential approach ensures proper adhesion and structural preparation, where the printed copper layers serve as pre-prepared bonding surfaces that facilitate subsequent DPC formation, thereby simplifying the overall manufacturing process despite the multi-step nature
Solution Approach 2:
The patent utilizes parameter changes by controlling the thickness and composition of each copper layer during the direct plating process. By optimizing parameters such as copper layer thickness, plating time, and chemical composition, the manufacturing process achieves high crack resistance while maintaining practical production efficiency and ease of manufacture
3Stability of the object's composition
If the ceramic circuit board undergoes temperature cycling tests, then the thermal stability is evaluated, but the board cracks due to insufficient reliability
Solution Approach 1:
The patent addresses thermal expansion by designing a copper multi-layer structure with appropriate thermal expansion characteristics that match the ceramic substrate. The direct plated copper structures and copper pillars are configured to accommodate thermal expansion differences between materials during temperature cycling, reducing stress concentration and preventing crack formation, thereby improving both thermal stability and crack resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves the ceramic circuit board's resistance to cracking, allowing it to withstand at least 500 temperature cycling tests without failure.
Implementation Method 1
Each of the two direct plated copper (DPC) structures includes a sputtered layer, a chemical plated copper layer, and an electroplated copper layer
Implementation Method 2
Each of the two direct plated copper (DPC) structures includes a sputtered layer, a chemical plated copper layer, and an electroplated copper layer
Implementation Method 3
Each of the two direct plated copper (DPC) structures includes a sputtered layer, a chemical plated copper layer, and an electroplated copper layer
Data Source
AI summary
A high reliability ceramic circuit board and method for producing the same are provided. The high reliability ceramic circuit board includes a ceramic substrate, a copper pillar structure, two printed copper layers, and two direct plated copper (DPC) structures. The ceramic substrate has a first surface and a second surface and has a through hole penetrating through the ceramic substrate. The copper pillar structure is formed in the through hole of the ceramic substrate. The two printed copper layers are respectively formed on the first surface and the second surface of the ceramic substrate, and the two printed copper layers are in contact with the copper pillar structure. The two direct plated copper (DPC) structures are respectively formed on the two printed copper layers. Each of the direct plated copper (DPC) structures includes a sputtered layer, a chemical plated copper layer, and an electroplated copper layer.