Ceramic Circuit Board Through-Hole Layout for Heat and Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing ceramic circuit boards face challenges with insufficient electrical capacity and heat dissipation due to limitations in metal circuits and ceramic substrates, particularly when using power semiconductors like SiC and GaN, leading to issues with bonding strength and thermal management in high-density semiconductor devices.
Innovation Solution
A ceramic circuit board design featuring a metal circuit bonded to a ceramic substrate via an active metal brazing material layer, with a through-hole in the metal circuit allowing for secure bonding of metal pins, using materials like copper and titanium, and a metal heat dissipation plate for improved thermal conductivity and bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal circuits are made thicker to improve heat dissipation, then thermal management is improved, but the ceramic substrate must be made thinner which reduces bonding strength
Solution Approach 1:
The invention divides the metal circuit into multiple layers, with thicker metal circuits positioned at the heat-generating side (substrate side) and thinner metal circuits at the opposite side. This segmentation allows the heat dissipation function to be concentrated where needed while maintaining overall structural integrity and bonding strength.
2Volume of moving object
If ceramic substrates are made thinner to reduce device size, then miniaturization is achieved, but electrical capacity and heat dissipation become insufficient
Solution Approach 1:
The invention transitions from a two-dimensional planar metal circuit to a three-dimensional multilayer metal circuit structure. By stacking multiple metal circuit layers and incorporating via holes for vertical electrical connections, the electrical capacity is enhanced in the vertical dimension, compensating for the reduced substrate thickness.
3Reliability
If via holes are formed in metal circuits to bond pin-shaped leadframes, then electrical connectivity is improved, but the metal circuit structure becomes more complex
Solution Approach 1:
The via holes in the metal circuit serve multiple functions: they provide electrical connectivity between different metal circuit layers, act as bonding locations for pin-shaped leadframes, and contribute to the overall structural framework. This multi-functionality reduces the need for separate components and simplifies the overall device structure despite the added via holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances electrical connectivity and thermal management by increasing bonding strength and reducing thermal resistance, ensuring reliable operation of semiconductor devices in applications like power modules and inverters.
Implementation Method 1
a metal circuit (3) bonded to a first surface (2a) of the ceramic substrate (2) via an active metal brazing material layer (4)
Data Source
AI summary
A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.