Ceramic Booster Antenna for Compact RFID Communication Range

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Solution Overview

Problem

Existing RFID tags with multilayer antennas have not achieved sufficient communication distance due to limitations in antenna efficiency.

Innovation Solution

A booster antenna is introduced, which includes a conductor pattern wound spirally in a ceramic insulating layer, electromagnetically coupled to the IC chip's antenna, enhancing transmission/reception sensitivity and increasing the information transmission distance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a multilayer antenna with many turns is used, then antenna efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveantenna efficiencyVSAvoidantenna structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The antenna system is divided into two independent parts: a planar spiral antenna integrated with the IC chip and a separate booster antenna. This segmentation allows each antenna to be optimized independently, with the booster antenna providing additional gain without complicating the integrated circuit structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The booster antenna acts as an intermediary element that couples with the planar spiral antenna to enhance its performance. This intermediary structure provides the additional antenna gain needed for longer communication distances without requiring the planar antenna itself to become more complex.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the antenna size is increased to improve communication distance, then antenna gain is improved, but the RFID tag cannot be miniaturized

Engineering Contradiction:
Improvecommunication distanceVSAvoidRFID tag size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The booster antenna is positioned in a different spatial dimension (above the planar spiral antenna) rather than expanding the planar area. This vertical arrangement allows the system to achieve higher gain without increasing the footprint of the RFID tag, enabling miniaturization while maintaining communication distance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The planar spiral antenna is integrated within the IC chip package, and the booster antenna is positioned above it, creating a nested configuration. This nesting allows both antennas to coexist in a compact volume, achieving high gain without increasing the overall RFID tag size.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The booster antenna significantly improves the communication distance of the RFID tag by increasing antenna gain and efficiency, while maintaining a simple configuration and environmental resistance.

Implementation Method 1

A booster antenna is introduced, which includes a conductor pattern wound spirally in a ceramic insulating layer, electromagnetically coupled to the IC chip's antenna, enhancing transmission/reception sensitivity and increasing the information transmission distance.

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentEP3866262B1RFID tag
Publication Date: 2025.01.22 SK ELECTRONICS CO LTD
  • EP3866262B1 patent drawingFigure 1A
  • EP3866262B1 patent drawingFigure 1B
  • EP3866262B1 patent drawingFigure 2A

AI summary

The present invention aims to provide a booster antenna (6) configured to operate at substantially the same frequency as an antenna (3) provided on an IC chip (1), the booster antenna (6) comprising: an insulating layer (8) made of ceramics; one conductor pattern (9) embedded in the ceramics of the insulating layer (8), the one conductor pattern (9) constituted by a conductor line (9a) wound into a spiral to have an opening (9K); and an insulating mount (10) on which the IC chip (1) is mounted, wherein the one conductor pattern (9) is an antenna configured to be electromagnetically coupled to the antenna (3) provided on the IC chip (1) mounted on the mount (10).