Laminated Ceramic Component Buffer Layer Shrinkage

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Laminated ceramic electronic components face issues with separation, delamination, and cracks due to differences in burning shrinkage and thermal expansion coefficients between functional and protective layers, which worsen with component thinning, multi-layering, and increased density, complicating manufacturing and affecting electrical characteristics and yield.

Innovation Solution

Incorporating a buffer layer with different burning shrinkage and thermal expansion coefficients into the protective layer to align the shrinkage characteristics of the functional and protective layers, reducing stress and preventing cracks, and simplifying the manufacturing process by using the same material composition for the substrate and internal electrode.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the protective layer has different binder content from the functional layer to adjust burning shrinkage, then delamination and cracks are prevented, but the manufacturing process becomes complicated

Engineering Contradiction:

Improveprevention of delamination and cracksVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces a buffer layer as an intermediary between the functional layer and protective layer. This buffer layer has different burning shrinkage characteristics from both adjacent layers, acting as a transition zone that gradually adjusts the shrinkage gradient. This eliminates the need for complex multi-layer binder content adjustments while effectively preventing delamination and cracks during burning and heat treatment processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If thinning, multi-layering, and greater density are implemented to achieve downsizing, then higher performance and greater functionality are achieved, but stress and physical strain along interfaces increase causing more prominent separation and delamination problems

Engineering Contradiction:

Improvedownsizing and functionality enhancementVSAvoidinterface stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by introducing buffer layers at specific interface locations where stress concentration occurs. These buffer layers have locally optimized burning shrinkage characteristics that differ from both the functional layer and protective layer, creating a gradual transition zone. This localized intervention effectively manages stress distribution at critical interfaces while maintaining the overall thinning and multi-layering structure for downsizing.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If heat treatment or burning is performed to manufacture the laminated ceramic electronic component, then the component is formed, but stress remaining during the process causes cracks

Engineering Contradiction:

Improvecomponent formationVSAvoidcrack prevention

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent utilizes parameter changes by carefully controlling the burning shrinkage characteristics of the buffer layer to be different from both the functional layer and protective layer. This parameter differentiation creates a gradient structure that progressively accommodates shrinkage stress during heat treatment and burning processes, preventing sudden stress concentration that would cause cracks while still enabling proper component formation.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively inhibits separation, delamination, and cracks, enhances electrical characteristics, improves production yield, and simplifies manufacturing by reducing the need for multiple sheets with different binder contents and allowing for easier adjustment of burning shrinkage and thermal expansion coefficients.

Implementation Method 1

the buffer layer has a different burning shrinkage from the ceramic substrate

Methodology Applied

Scientific EffectBurning shrinkage:

Implementation Method 2

Making the burning shrinkage of the functional layer approximately agree with the burning shrinkage of the protective layer decreases stress along the interface between the functional layer and the protective layer

Methodology Applied

Scientific EffectStress reduction:

Implementation Method 3

even if separation, delamination or cracks occur in the vicinity of the surface of the laminated ceramic electronic component, the cracks and the like can be stopped by the buffer layer

Methodology Applied

Scientific EffectCrack propagation inhibition: Fracture Mechanics

Data Source

PatentUS7394646B2Laminated ceramic electronic component

Publication Date: 2008.07.01 TDK CORP

AI summary

A laminated ceramic electronic component includes a ceramic substrate, an internal electrode, and a buffer layer. The ceramic substrate includes a protective layer and a functional layer. The protective layer is disposed on at least one side of the functional layer. The internal electrode is embedded in the functional layer. The buffer layer is embedded in the protective layer and has a different burning shrinkage from the ceramic substrate.