Ceramic Bushing Sintered Connection for Implantable Devices
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Solution Overview
Problem
Existing implantable medical devices face challenges in achieving a durable and hermetically sealed connection between metal lead wires and ceramic base bodies, as metallization within the ceramic is difficult and requires expensive processes, leading to laborious and hard-to-automate soldering procedures.
Innovation Solution
A housing for implantable medical devices is proposed, utilizing an electrically insulating ceramic material with a cermet-based conducting element, where the ceramic region and conducting element are connected through a firmly bonded sintered connection, eliminating the need for additional soldering components and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metallization is applied within the ceramic to connect lead wires and ceramic base body, then electrical connection is achieved, but the process becomes expensive and difficult to automate
Solution Approach 1:
The patent extracts the metallization step from the ceramic processing sequence and replaces it with a ceramic insert that is pre-formed with conductive properties. This removes the complex metallization process while maintaining electrical connection functionality through the conductive ceramic insert itself.
Solution Approach 2:
The patent changes the electrical conductivity parameter of the ceramic material by incorporating conductive phases or additives during the ceramic insert formation process. This transforms the traditionally insulating ceramic into a conductive element that can establish electrical connections without requiring separate metallization steps.
2Reliability
If traditional soldering procedures are used to connect lead wires to metallized ceramic, then electrical connection is established, but the process becomes laborious and hard to automate
Solution Approach 1:
The patent merges the electrical connection function and mechanical support function into a single conductive ceramic insert component. This integration eliminates the need for separate soldering operations, as the insert provides both structural support and electrical conductivity through its material composition and internal structure.
Solution Approach 2:
The patent replaces the mechanical soldering process with a material-based solution where the conductive ceramic insert inherently provides electrical connection through its compositional structure. This substitution eliminates the need for thermal processing and manual soldering operations.
3Reliability
If expensive metallization processes are used within ceramic, then hermetic sealing is achieved, but manufacturing cost increases
Solution Approach 1:
The patent uses a cost-effective ceramic insert material that achieves hermetic sealing through its formulation and processing rather than expensive metallization layers. The insert is designed to provide the necessary sealing and conductive properties through more economical ceramic-based materials and processes.
Solution Approach 2:
The patent employs composite ceramic materials that combine insulating ceramic phases with conductive phases or additives. This composite structure provides both hermetic sealing properties and electrical conductivity without requiring separate metallization layers, reducing overall manufacturing cost while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-efficient, reliable, and automated method for creating a hermetically sealed and biocompatible connection between the ceramic housing and conducting elements, enhancing the mechanical stability and sealing properties of the device while reducing the risk of moisture ingress.
Implementation Method 1
the housing and the at least one conducting element are connected in a firmly bonded sintered connection
Data Source
AI summary
One aspect relates to a housing for an active implantable medical device, whereby the housing, at least parts thereof, includes an electrically insulating ceramic material, and has at least one electrically conductive conducting element, whereby the at least one conducting element is set up to establish at least one electrically conductive connection between an internal space of the housing and an external space.One aspect provides the at least one conducting element to include at least one cermet, whereby the housing and the at least one conducting element are connected in a firmly bonded manner.