Laminated Ceramic Capacitor Low ESR Alloy Interface
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Solution Overview
Problem
Ceramic electronic components with small height dimensions face challenges such as increased equivalent series resistance (ESR) due to small internal electrode areas and difficulties in forming a sufficient bonded area between internal and external electrodes, exacerbated by glass reactions during firing.
Innovation Solution
A ceramic electronic component with a metal medium and glass medium integrated external electrode, featuring a Ni-Cu alloy layer at the interface between the external electrode, ceramic main body, and internal electrode, along with a plating film, to enhance the bonded area and reduce ESR.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the height dimension of the laminated-type capacitor is reduced to decrease in size and thickness, then the component size is reduced, but the area of internal electrodes becomes small and the number of laminated internal electrodes is reduced, causing the equivalent series resistance to increase
Solution Approach 1:
The patent applies local quality by creating a reaction layer with specific composition and structure at the interface between external electrodes and ceramic main body. This reaction layer, formed through controlled glass frit reaction, provides localized improved electrical conductivity and bonding at the critical electrode-ceramic interface, thereby reducing ESR without requiring changes to the overall component dimensions or internal electrode configuration
Solution Approach 2:
The patent utilizes composite materials by forming a reaction layer that combines glass frit, metal particles, and ceramic materials. This composite structure at the electrode-ceramic interface creates a multi-functional layer that simultaneously provides electrical conductivity, mechanical bonding, and chemical stability, effectively reducing ESR in thin-profile capacitors
2Strength
If glass frit is contained in external electrodes to form a reaction layer at the interface, then bonding is enhanced, but the bonded area between internal electrodes and external electrodes is hindered, making the increased ESR problem more noticeable
Solution Approach 1:
The patent applies parameter changes by precisely controlling the composition, thickness, and microstructure of the reaction layer. By adjusting glass frit particle size, metal particle content, and firing conditions, the reaction layer is optimized to provide adequate bonding strength while maintaining sufficient electrical conductivity. The metal particles within the reaction layer serve as conductive pathways, compensating for the insulating nature of glass frit
Solution Approach 2:
The reaction layer is designed as a composite material system combining glass frit for bonding, metal particles for conductivity, and ceramic materials for structural integrity. This composite approach allows the reaction layer to simultaneously achieve strong mechanical bonding and low electrical resistance, resolving the contradiction between bonding strength and ESR
3Ease of operation
If barrel polishing is applied to expose internal electrodes, then electrode exposure is achieved, but the component is susceptible to cracks and chips, making sufficient treatment difficult
Solution Approach 1:
The patent applies preliminary action by forming the reaction layer before final electrode exposure operations. The reaction layer, created during the firing process, pre-establishes a protective and conductive interface that reduces the need for aggressive subsequent polishing. This preliminary formation of the interface layer allows for gentler exposure processes that minimize mechanical stress and prevent cracking
Solution Approach 2:
The reaction layer serves as an intermediary between the ceramic main body and the external environment during the electrode exposure process. This intermediate layer protects the underlying ceramic structure from mechanical damage during polishing while still allowing for adequate electrode exposure, thus maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces the ESR of ceramic electronic components by increasing the bonded area between internal and external electrodes, improving connectivity and performance.
Implementation Method 1
an alloy layer of a metal contained in the external electrode and a metal contained in the internal electrode is arranged at an interface between the external electrode, and the ceramic main body and the internal electrode
Data Source
AI summary
External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.