Ceramic Capacitor Electrode Layout to Suppress Baking Cracks
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Solution Overview
Problem
The diffusion of external electrode components into internal electrodes during baking leads to stress expansion and cracking in ceramic electronic components, particularly when low-melting point metals are used, compromising mechanical strength and reliability.
Innovation Solution
A ceramic electronic component design with alternating internal electrode layers of different metal concentrations and widths, where the first internal electrode layer contains a higher concentration of low-melting point metal and has a narrower width, while the second layer has a wider width, minimizing the diffusion path of copper during external electrode baking and reducing stress-induced cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If low-melting point metal is added to internal electrode layers to improve solderability and electrical connection, then electrical performance is improved, but stress-induced cracking occurs during external electrode baking
Solution Approach 1:
The patent applies local quality by creating asymmetric internal electrode layer structures where the first internal electrode layer contains low-melting point metal with a first width, and the second internal electrode layer has a second width different from the first. This localized differentiation allows specific regions to have optimized properties for their function while managing stress distribution to prevent cracking during baking.
Solution Approach 2:
The patent employs asymmetry by designing internal electrode layers with unequal widths and different low-melting point metal concentrations. The first internal electrode layer has a first width and contains low-melting point metal at a first concentration, while the second internal electrode layer has a second width and contains low-melting point metal at a second concentration. This asymmetric configuration balances electrical performance with stress management during the baking process.
2Reliability
If external electrode components diffuse into internal electrodes during baking to improve electrical contact, then electrical conductivity is improved, but stress expansion and cracking occur
Solution Approach 1:
The patent applies local quality by creating asymmetric internal electrode layer structures where the first internal electrode layer contains low-melting point metal with a first width, and the second internal electrode layer has a second width different from the first. This localized differentiation allows specific regions to have optimized properties for their function while managing stress distribution to prevent cracking during baking.
Solution Approach 2:
The patent employs parameter changes by varying the width and low-melting point metal concentration of internal electrode layers. The first internal electrode layer has a first width and contains low-melting point metal at a first concentration, while the second internal electrode layer has a second width and contains low-melting point metal at a second concentration. This asymmetric configuration balances electrical performance with stress management during the baking process.
3Productivity
If mounting area is reduced to achieve higher functionality, then device integration is improved, but mechanical strength and reliability are compromised
Solution Approach 1:
The patent applies local quality by creating asymmetric internal electrode layer structures where the first internal electrode layer contains low-melting point metal with a first width, and the second internal electrode layer has a second width different from the first. This localized differentiation allows specific regions to have optimized properties for their function while managing stress distribution to prevent cracking during baking.
Solution Approach 2:
The patent employs composite materials by combining nickel-based internal electrode layers with low-melting point metal additions in asymmetric configurations. The first internal electrode layer contains low-melting point metal at a first concentration, while the second internal electrode layer contains low-melting point metal at a second concentration, creating a composite structure that optimizes both electrical performance and mechanical strength in compact designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses cracking and enhances mechanical strength by controlling stress distribution, ensuring reliable performance and electrostatic capacity in ceramic capacitors.
Implementation Method 1
The diffusion of external electrode components into internal electrodes during baking leads to stress expansion and cracking in ceramic electronic components
Data Source
AI summary
The first internal electrode layer contains a low-melting point metal having a melting point lower than the melting point of Pb. The concentration of the low-melting point metal is higher in the first internal electrode layer than in the second internal electrode layer. The width in a direction orthogonal to the stacking direction of a portion of the first internal electrode layer connecting to the first external electrode is narrower than the width of a portion facing the second internal electrode layer. The width in a direction orthogonal to the stacking direction of a portion of the second internal electrode layer connecting to the second external electrode is wider than the width of a portion of the first internal electrode layer connecting to the first external electrode.