Multilayer Ceramic Capacitor Electrode Structure for Crack Control
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Solution Overview
Problem
Existing multilayer ceramic capacitors with a three-layer resin external electrode configuration have high manufacturing costs and varying cohesive forces due to random void distribution, leading to decreased mechanical strength.
Innovation Solution
A multilayer ceramic capacitor design featuring flat-shaped metal fillers with voids on their surfaces in the electrically conductive resin layer, which controls crack propagation and enhances mechanical strength by preferentially breaking the resin layer under stress instead of the dielectric layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a three-layer resin external electrode configuration is used, then electrical conductivity is improved, but manufacturing cost increases and cohesive force varies due to random void distribution
Solution Approach 1:
The invention extracts the harmful random void distribution from the resin electrode layer by introducing a controlled void structure only in the intermediate layer. This separates the void function from the entire three-layer structure and concentrates it where it provides benefit (crack propagation control) without compromising the cohesive force in the base copper-side and plating-side layers.
Solution Approach 2:
The invention applies different structural characteristics to different layers: the base copper-side layer and plating-side layer maintain dense structures for high cohesive force, while the intermediate layer contains controlled voids for crack propagation control. This local differentiation optimizes each layer's function and resolves the contradiction between conductivity and structural integrity.
2Reliability
If a three-layer resin external electrode configuration is used, then electrical conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The invention extracts the void structure from the entire resin electrode and concentrates it only in the intermediate layer. This simplifies the manufacturing process by eliminating the need to control void distribution across all three layers, thereby reducing manufacturing complexity and cost while maintaining electrical conductivity benefits.
Solution Approach 2:
The invention changes the void content parameter specifically in the intermediate layer (5-50%) while keeping the other layers dense. This parameter differentiation allows optimization of electrical conductivity without uniformly increasing manufacturing complexity across the entire resin electrode structure.
3Ease of manufacture
If voids are randomly distributed in the resin electrode layer, then manufacturing is simplified, but mechanical strength decreases due to variation in cohesive force
Solution Approach 1:
The invention introduces controlled voids only in the intermediate layer while keeping the base copper-side and plating-side layers dense. This local quality differentiation allows the voids to serve as crack propagation control features without compromising the cohesive force and mechanical strength in the outer layers.
Solution Approach 2:
The invention converts the potentially harmful random void distribution into a beneficial controlled void structure in the intermediate layer. These voids act as crack propagation control features that redirect cracks away from critical areas, thereby improving mechanical strength rather than decreasing it.
4Strength
If voids are provided on the surface of flat-shaped metal fillers, then crack propagation is controlled and mechanical strength is improved, but manufacturing precision requirements increase
Solution Approach 1:
The invention concentrates the complex void structure only in the intermediate layer, where manufacturing precision can be more easily controlled. The base copper-side and plating-side layers remain simple and dense, reducing the overall manufacturing precision requirements while still achieving crack propagation control in the critical intermediate region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves mechanical strength by reducing crack propagation into dielectric layers, maintaining capacitor integrity under thermal and mechanical stress.
Implementation Method 1
an electrically conductive resin layer on the base electrode layer and including a thermosetting resin and a metal filler
Implementation Method 2
the metal filler in the electrically conductive resin layer is a flat-shaped filler with a flat shape, and a void is provided on a surface of the flat-shaped filler
Data Source
AI summary
A laminated ceramic capacitor includes dielectric layers, first and second internal electrode layers respectively exposed at first and second end surfaces, and first and second external electrodes respectively on first and second end surfaces. The first and second external electrodes include an underlying electrode layer including a metal component, a conductive resin layer above the underlying electrode layer and including a thermosetting resin and a metal filler, and a plating layer above the conductive resin layer. The metal filler of the conductive resin layer includes a flat filler with a flat shape. A void is included on a surface of the flat filler.