Multilayer Ceramic Capacitor Structure With DC Current Bypass
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Solution Overview
Problem
Existing feed-through three-terminal capacitors face limitations in increasing the number of signal internal electrodes within a certain size constraint, leading to high DC resistance and poor scalability, especially when used as noise filters for high-speed integrated circuits.
Innovation Solution
A multilayer ceramic capacitor design with a conductor portion connected to outer electrodes, allowing DC current to bypass the capacitor, reducing DC resistance and enabling scalable product lineup without redesigning the inner structure for each capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of signal internal electrodes is increased to reduce DC resistance, then DC resistance decreases, but the device size increases beyond certain constraints
Solution Approach 1:
The invention divides the current path into two segments: one through the capacitor (for AC noise filtering) and one through the conductor portion (for DC current). This segmentation allows DC current to bypass the capacitor via the conductor portion connected to outer electrodes, reducing DC resistance without requiring additional signal internal electrodes that would increase device size.
Solution Approach 2:
The conductor portion acts as an intermediary element that provides a low-resistance path for DC current between the outer electrodes. This intermediary structure enables DC current to flow without passing through the capacitor's internal electrode structure, thereby reducing DC resistance while maintaining compact dimensions.
2Reliability
If the inner structure is uniquely designed for each electrostatic capacitance, then electrostatic capacitance requirements are met, but product lineup scalability deteriorates
Solution Approach 1:
The conductor portion structure serves multiple functions: it provides DC current bypass for all capacitance values and maintains a consistent structural design across different product variants. This universal design approach allows the same basic structure to be used throughout the product lineup, improving scalability while meeting different electrostatic capacitance requirements through configuration variations rather than complete redesigns.
3Device complexity
If DC current flows through the capacitor, then the capacitor structure is simple, but heat generation increases due to high DC resistance
Solution Approach 1:
The conductor portion serves as an intermediary that intercepts DC current before it can flow through the capacitor's internal electrode structure. By providing this alternative low-resistance path, the conductor portion reduces power loss (I²R heating) while adding minimal structural complexity to the overall device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively manages DC resistance and electrostatic capacitance, facilitating larger current handling and expanding product lineup without increasing size, while maintaining low ESL effects.
Implementation Method 1
a conductor portion electrically connected to the first outer electrode and the second outer electrode
Implementation Method 2
a multilayer ceramic capacitor including a multilayer body that includes a plurality of dielectric layers
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer body including dielectric layers, first and second main surfaces facing away from each other in a lamination direction, first and second side surfaces facing away from each other in a width direction, first and second end surfaces facing away from each other in a length direction, a first inner electrode layer exposed to the first end surface and the second end surface and a second inner electrode layer exposed to the first side surface and the second side surface, first and second outer electrodes connected to the first inner electrode layer, and third and fourth outer electrodes connected to the second inner electrode layer, and a conductor portion electrically connected to the first and second outer electrodes. A DC resistance of the conductor portion is smaller than a DC resistance of the multilayer ceramic capacitor.