Monolithic Ceramic Capacitor Degreasing to Prevent Electrode Sagging
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Solution Overview
Problem
The manufacturing of smaller monolithic ceramic capacitors with higher capacitances is hindered by the occurrence of short-circuited portions and high short circuit failure rates due to sagging of internal electrodes during the cutting process, which is exacerbated by stress and contact between electrodes on the cut side surfaces.
Innovation Solution
Treating the cut side surfaces of green chips or rod-shaped green blocks with a degreasing agent, either as a separate step or incorporated in the cutting fluid, grinding fluid, or ultrasonic cleaning solution, to remove sagging internal electrodes and prevent short-circuiting, thereby reducing the occurrence of short-circuited portions and lowering the short circuit failure rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the mother block is cut by dicing to obtain green chips with exposed internal electrodes, then the effective area of internal electrodes is increased, but the internal electrodes sag due to cutting stress causing short-circuited portions
Solution Approach 1:
The patent applies preliminary action by treating the cut side surface with a degreasing agent immediately after cutting to remove resin components before they cause significant sagging. This preventive treatment removes the adhesive resin that binds internal electrodes, preventing short-circuited portions from forming during subsequent handling and firing processes.
Solution Approach 2:
The patent converts the harmful effect of resin components (which cause sagging and short circuits) into a beneficial process by using the degreasing agent to selectively remove only the resin binder from the conductive paste, leaving the metallic internal electrodes intact. This transforms the problematic resin into a removable substance that, when eliminated, prevents short circuits while maintaining electrode integrity.
2Quantity of substance
If the distance between internal electrodes is reduced to increase capacitance, then higher capacitance is achieved, but the occurrence of short-circuited portions increases
Solution Approach 1:
By applying the degreasing treatment immediately after cutting, the patent removes resin components before they can cause electrode migration and short circuits. This preliminary removal of adhesive substances is critical when electrodes are closely spaced, as it prevents even minor sagging from resulting in short circuits between adjacent electrodes.
Solution Approach 2:
The patent applies local quality by treating only the cut side surface where internal electrodes are exposed, rather than the entire component. This localized treatment targets the specific area where short circuits occur, removing resin components from the cut surface while leaving other areas unchanged, thereby preventing short circuits without affecting the overall electrode structure.
3Productivity
If dicing is used to cut the mother block, then manufacturing efficiency is improved, but cutting stress causes internal electrode sagging
Solution Approach 1:
The patent converts the harmful cutting stress that causes sagging into a manageable issue by immediately removing the resin components that enable the sagging. The dicing process remains efficient, but the subsequent degreasing treatment eliminates the adhesive resin, preventing stress-induced electrode migration while maintaining the high productivity benefits of dicing.
Solution Approach 2:
The degreasing agent acts as an intermediary substance that mediates between the cutting process and the final product quality. It removes the resin components that transfer cutting stress to the internal electrodes, thereby preventing electrode sagging while allowing the efficient dicing process to continue unchanged.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of degreasing agents effectively reduces the occurrence of short-circuited portions and lowers the short circuit failure rate in monolithic ceramic electronic components by removing sagging internal electrodes, resulting in more reliable and efficient manufacturing processes.
Implementation Method 1
a resin component in the conductive paste for forming the internal electrodes is emulsified and/or degreased due to the action of the degreasing agent
Implementation Method 2
a resin component in the conductive paste for forming the internal electrodes is emulsified and/or degreased due to the action of the degreasing agent
Implementation Method 3
the cut side surface is ultrasonically cleaned
Data Source
AI summary
A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.