Multilayer Ceramic Capacitor with Elastic Support

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Solution Overview

Problem

Multilayer ceramic electronic components used in automotive electrical control units face challenges in durability and reliability due to thermal and mechanical stress, with metal frames increasing costs and limiting modularization.

Innovation Solution

A multilayer ceramic electronic component design featuring a capacitor set connected in series within an insulation case with external electrodes and metal terminals, where one end is elastically supported by a compression spring, allowing for absorption of mechanical stress and reduced thermal stress through the use of an insulation case with through holes and a unique terminal structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal frame is used to satisfy high reliability against thermal and mechanical stress, then reliability is improved, but product cost increases rapidly

Engineering Contradiction:

Improvereliability against thermal and mechanical stressVSAvoidproduct cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the expensive metal frame with a resin case that has a shorter service life but provides sufficient protection for the capacitor assembly. The resin case absorbs thermal and mechanical stress while being significantly cheaper to manufacture, thus resolving the contradiction between reliability and manufacturing cost.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameter from metal to resin, and modifies the structural parameters by adding through-holes and specific geometric features to the case. These parameter changes allow the resin case to achieve the mechanical strength and thermal stress absorption previously only available from metal frames, while reducing cost.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a metal frame is used to ensure high reliability, then reliability is improved, but the ability to connect multiple capacitors for modularization is limited

Engineering Contradiction:

Improvereliability against thermal and mechanical stressVSAvoidmodularization capability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent divides the capacitor assembly into modular units, each consisting of multiple capacitors connected in series within an individual resin case. This segmentation allows multiple standardized modules to be connected together to create larger capacitor assemblies with different voltage ratings, thereby enabling modularization while maintaining reliability through the resin case design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resin case design with standardized through-holes and terminal configurations serves multiple functions: mechanical support, stress absorption, electrical connection, and modular interface. This multi-functionality enables the same case design to be used across different voltage and capacitance configurations, facilitating modularization while maintaining high reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If traditional connection methods with solder or conductive adhesives are used, then electrical connection is achieved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the mechanical support function and electrical connection function into a single integrated resin case structure. The through-holes and terminal structures are built directly into the case, eliminating the need for separate soldering or adhesive bonding processes. This integration maintains reliable electrical connections while significantly simplifying the manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the traditional mechanical-electrical connection system (solder joints or adhesive bonds) with a direct mechanical-electrical integrated structure in the resin case. The terminals are formed as integral parts of the case, providing both mechanical support and electrical connection pathways without requiring additional materials or processes, thus reducing manufacturing complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances durability and reliability against thermal and mechanical stress, reduces manufacturing costs by eliminating the need for solder or conductive adhesives, and improves product yield and quality by absorbing external forces effectively.

Implementation Method 1

One end portion of the capacitor set may be elastically supported by one of the pair of metal terminals

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9978525B2Multilayer ceramic electronic component

Publication Date: 2018.05.22 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer ceramic electronic component includes: a capacitor set including a plurality of multilayer ceramic capacitors connected in series and accommodated in an insulation case while exposing external electrodes provided on both end portions thereof; and a pair of metal terminals connected to the external electrodes exposed outside of the insulation case, respectively. One end portion of the capacitor set is elastically supported by one of the pair of metal terminals.