Multilayer Ceramic Capacitor External Electrode Adhesion
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Solution Overview
Problem
Multilayer ceramic electronic components face issues with low adhesive force between the conductive resin electrode layer and the sintered electrode layer, leading to separation during substrate deflection, which affects the component's reliability and performance.
Innovation Solution
The introduction of a sintered metal layer with glass and metal, including recesses for enhanced anchor effect, combined with a conductive resin layer containing metal particles and a plating layer, improves the adhesive strength by ensuring better mechanical bonding and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conductive resin electrode layer containing a large amount of resin is used, then the resistance to substrate deflection is improved, but the adhesive force between the conductive resin electrode layer and the sintered electrode layer becomes weak
Solution Approach 1:
The sintered electrode layer is formed with recesses (grooves) in advance before applying the conductive resin electrode layer. This preliminary structural preparation enables the resin to mechanically interlock with the metal particles, preventing separation while maintaining flexibility for substrate deflection resistance
Solution Approach 2:
Metal particles are introduced as an intermediary substance within the conductive resin electrode layer. These metal particles serve as anchoring points that mechanically connect the resin matrix to the sintered electrode layer, enhancing adhesive force while preserving the resin's flexibility
2Adaptability or versatility
If the conductive resin electrode layer contains a large amount of resin, then flexibility is improved, but adhesive force to the sintered electrode layer decreases
Solution Approach 1:
The conductive resin electrode layer is designed as a composite material system consisting of resin matrix combined with metal particles. This composite structure leverages the flexibility of resin while utilizing the mechanical strength and adhesion properties of metal particles to prevent layer separation
Solution Approach 2:
The sintered electrode layer is pre-formed with recesses that are specifically designed to receive and mechanically interlock with the conductive resin electrode layer containing metal particles, enabling strong adhesion while maintaining resin flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances the adhesive force between the sintered metal and conductive resin layers, reducing the likelihood of separation and improving the component's resistance to substrate deflection, thereby enhancing the overall reliability and performance of the multilayer ceramic electronic components.
Implementation Method 1
the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer
Implementation Method 2
the conductive resin layer includes resin and metal particles; the sintered metal layer includes glass and metal
Data Source
AI summary
A multilayer ceramic capacitor includes a ceramic element body including internal electrodes therein. External electrodes are provided on end surfaces of the ceramic element body and electrically connected to exposed portions of respective ones of the internal electrodes. Each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer. In a cross section including a first interface between the sintered metal layer and the conductive resin layer, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface, and in a cross section including a second interface between the conductive resin layer and the plating layer, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250.


