Multilayer Ceramic Capacitor Structure for Stronger Electrode Bonding

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Solution Overview

Problem

The bonding force between the laminate and the plated film in multilayer ceramic capacitors is weak, leading to potential peeling issues, and the manufacturing process can cause interlayer peeling due to excessive force at the laminate's corners, degrading reliability.

Innovation Solution

The multilayer ceramic capacitor design includes dummy electrodes with greater thickness than internal electrode layers, exposed at the ends and surfaces, and connected by external electrodes, reducing material interfaces and enhancing bonding strength through increased contact areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the laminate is polished to expose internal electrode layers, then the external electrodes can be properly formed, but interlayer peeling occurs at the corners due to excessive force

Engineering Contradiction:
Improveexposure of internal electrode layersVSAvoidinterlayer peeling
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces a dummy electrode layer with greater thickness than internal electrode layers at the corner regions where peeling is most likely to occur. This thicker dummy electrode acts as a cushioning layer that absorbs polishing forces and prevents interlayer peeling during the polishing process, while still allowing proper exposure of internal electrode layers for external electrode formation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Ease of manufacture

If conventional thin electrode layers are used, then the capacitor can be manufactured with standard processes, but the bonding force between laminate and plated film is weak

Engineering Contradiction:
Improvestandard manufacturing processVSAvoidbonding force
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent changes the thickness parameter of specific electrode layers (dummy electrodes) to be greater than the standard internal electrode layer thickness. This parameter change enhances the bonding force between the laminate and plated film without requiring changes to the overall manufacturing process, as the thicker electrodes provide better mechanical anchoring and bonding surface area.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If the capacitor size is reduced for compact applications, then space efficiency improves, but the bonding area and strength are reduced

Engineering Contradiction:
Improvecapacitor sizeVSAvoidbonding strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent applies local quality by concentrating the thicker dummy electrode layers specifically at the corner regions where bonding is most critical, rather than uniformly increasing the thickness of all electrode layers throughout the capacitor. This localized approach enhances bonding strength at key areas while maintaining the overall compact size of the capacitor.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12537140B2Multilayer ceramic capacitor
Publication Date: 2026.01.27 KYOCERA CORP
  • US12537140B2 patent drawing
  • US12537140B2 patent drawing
  • US12537140B2 patent drawing

AI summary

A multilayer ceramic capacitor includes a laminate that includes an active portion formed by laminating dielectric layers and internal electrode layers, first and second covering portions that are positioned at respective ends of the active portion in a laminating direction, first and second surfaces, first and second end surfaces, first and second side surfaces. The multilayer ceramic capacitor also includes external electrodes. The first covering portion includes first and second dummy electrodes. The second covering portion includes third and fourth dummy electrodes. The first and third dummy electrodes are exposed at the first end surface. The second and fourth dummy electrodes are exposed at the second end surface. At least one of the first to fourth dummy electrodes has a greater thickness than a thickness of the internal electrode layers.