Multi-layered Ceramic Capacitor Electrode Connectivity
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Solution Overview
Problem
Multi-layered ceramic capacitors face challenges in maintaining high capacitance and internal electrode connectivity due to abnormal grain growth and sintering shrinkage issues, which reduce capacitance and deteriorate connectivity during the firing process.
Innovation Solution
The solution involves forming internal electrodes with 70% or more non-electrode regions distributed between 5% inwardly spaced points from the electrode boundaries, using a conductive paste with ceramic powder, and optimizing the firing process at a heating rate of 30° C./60 s to 50° C./60 s at 700° C. or less to ensure 90% connectivity and a dielectric layer thickness of 0.6 μm or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If ceramic powder is added to internal electrode paste to match sintering shrinkage, then sintering compatibility is improved, but abnormal grain growth occurs at the interface between dielectric layer and internal electrode
Solution Approach 1:
The patent applies local quality by creating distinct regions within the internal electrode: a first region containing ceramic powder for shrinkage matching, and a second region without ceramic powder to prevent abnormal grain growth. This spatial differentiation of material composition resolves the contradiction between achieving sintering compatibility and preventing interface grain growth.
2Stability of the object's composition
If dielectric layer thickness is increased to compensate for grain growth, then interface stability is improved, but capacitance is reduced
Solution Approach 1:
The patent extracts the harmful element (ceramic powder) from specific regions where it causes abnormal grain growth, while retaining it in regions where it provides shrinkage matching benefits. This selective removal allows maintaining thin dielectric layers without compromising interface stability, thereby preserving high capacitance.
3Length of moving object
If internal electrode thickness is reduced for miniaturization, then device size is reduced, but connectivity of internal electrode deteriorates
Solution Approach 1:
The patent changes the material composition parameters of the internal electrode by introducing dual-region structure with different ceramic powder contents. This parameter modification enables thin internal electrodes to maintain high connectivity (90% or more) despite reduced thickness, resolving the contradiction between miniaturization and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the connectivity of internal electrodes to 90% or more, maintaining high capacitance and reliability in multi-layered ceramic capacitors, even in miniaturized and highly stacked configurations.
Implementation Method 1
ceramic powder is added to a paste for the internal electrode... during a firing process... sintering shrinkage behaviors
Implementation Method 2
match sintering shrinkage behaviors of the plurality of dielectric layers and the internal electrodes
Data Source
AI summary
There are provided a multi-layered ceramic electronic component and a method of manufacturing the same. The multi-layered ceramic electronic component includes: a ceramic body; internal electrodes formed within the ceramic body and including non-electrode regions formed therein; and external electrodes formed on ends of the ceramic body and electrically connected to the internal electrodes, wherein in a cross section of the internal electrode, 70% or more of the non-electrode regions are distributed in a region formed between points inwardly spaced apart from each of the upper and lower boundary surfaces of the internal electrodes by 5%.