Laminated Ceramic Capacitor Electrode Design for Thin Profile High Capacitance
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Solution Overview
Problem
Conventional laminated ceramic capacitors face challenges in achieving a balance between thinness and capacitance, as reducing the thickness to meet downsizing demands necessitates fewer ceramic and internal electrode layers, which decreases capacitance, and the external electrodes require a larger area for reliable bonding, complicating the design.
Innovation Solution
The design incorporates a laminated ceramic element with thinner lead parts and external electrodes that include extended and curled parts, allowing for a thicker function part while maintaining a thinner profile, and using conductive pastes and metal layers to enhance bonding strength and capacitance without increasing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the laminated ceramic element is reduced to meet downsizing demands, then the size of the capacitor is reduced, but the number of lamination of ceramic layers and internal electrode layers must be reduced, thereby decreasing the capacitance
Solution Approach 1:
The patent extends the external electrode onto the main face of the capacitor in addition to the end faces, utilizing the surface area of the main face to increase the effective bonding area. This dimensional extension allows the electrode to occupy multiple spatial dimensions (end face + main face), thereby increasing capacitance without increasing the thickness of the ceramic element.
Solution Approach 2:
The external electrode is divided into multiple segments: a base electrode layer formed by dip coating, and an additional metal layer formed by plating. This segmentation allows the electrode structure to be optimized independently - the base layer provides bonding area extension while the metal layer enhances conductivity and bonding strength, resolving the contradiction between thinness and capacitance.
2Reliability
If the external electrode is prolonged to ensure bonding area and reliability, then the bonding strength with conductor junction is improved, but the thickness of the external electrode increases due to dip coating viscosity
Solution Approach 1:
The external electrode is segmented into a base electrode layer and a metal layer. The base electrode layer (formed by dip coating) provides the extended bonding area onto the main face, while the metal layer (formed by plating) provides enhanced conductivity and bonding strength. This segmentation allows the bonding area to be extended without proportionally increasing the thickness, as the metal layer can be applied as a thin film with high conductivity.
Solution Approach 2:
The external electrode uses a composite structure combining the base electrode layer material and the metal layer material. This composite approach allows optimization of different properties: the base layer provides area extension while the metal layer provides electrical performance, resolving the contradiction between bonding area and thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for increased capacitance while maintaining a compact size, ensuring reliable electrical bonding and improved reliability of the laminated ceramic capacitors by optimizing the structure of the external electrodes and internal electrode layers.
Implementation Method 1
Base electrode layer 45 is formed by applying the end of laminated ceramic element 43 with a conductive paste by dip coating
Implementation Method 2
Metal layer 46 is formed by plating base electrode layer 45
Implementation Method 3
Laminated ceramic element 43 is formed of internal electrode layers 42 and ceramic layers 41 alternately laminated
Implementation Method 4
the laminated body is fired to produce the laminated ceramic element
Data Source
AI summary
Method for producing a laminated ceramic electronic component including: forming a laminated body by layering and press-bonding a plurality of ceramic green sheets to become a protective layer and a plurality of the ceramic green sheets with metal paste printed thereon, forming an extended part by printing and drying a conductive paste for the extended part on the main face of the laminated body, forming a laminated ceramic element by cutting off the laminated body with the extended part formed and separating the laminated body into fragments, and forming a curled part by applying a conductive paste for the curled part on said end face of said laminated ceramic element. In the step of forming the laminated body, the laminated body is press-bonded so that the main face of the lead part of the laminated body is positioned lower than the main face of the function part.