Ceramic Capacitor Electrode Geometry for Low ESL Embedding
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Solution Overview
Problem
Ceramic capacitors face challenges in being embedded into substrates due to high equivalent series inductance (ESL) and reliability issues with connections between via hole electrodes and external electrodes, leading to potential breakage and cracks.
Innovation Solution
A ceramic capacitor design with specific internal and external electrode configurations, including extended portions on side surfaces and a Cu plated layer, reduces ESL and enhances connection reliability by diffusing shocks and improving adhesion to substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the height dimension of ceramic capacitors is reduced for embedding into substrates, then the suitability for substrate embedding is improved, but the strength of the ceramic capacitors decreases, leading to breakage or cracks
Solution Approach 1:
The patent applies beforehand cushioning by providing a resin layer between the ceramic capacitor and the substrate. This resin layer acts as a cushioning element that absorbs and distributes mechanical stress, preventing stress concentration at the ceramic-substrate interface. The resin layer compensates for the reduced strength caused by smaller height dimensions, thereby preventing breakage and cracks while maintaining suitability for substrate embedding.
2Reliability
If multi-terminal capacitors are designed to achieve lower ESL, then the equivalent series inductance is reduced for high frequency use, but the ability to be embedded into substrates with reliable connections is compromised
Solution Approach 1:
The patent applies dimensionality change by extending internal electrodes not only in the vertical direction but also laterally to the side surfaces of the ceramic capacitor. This creates extended portions that protrude from the side surfaces, providing additional connection points in a different spatial dimension. This allows via holes to be formed from the substrate to connect with these extended portions, enabling reliable substrate embedding while maintaining the multi-terminal configuration for low ESL.
3Reliability
If internal electrodes are extended to side surfaces to reduce ESL, then the equivalent series inductance is reduced for high frequency applications, but the complexity of electrode configuration increases
Solution Approach 1:
The patent applies merging by integrating the extended portions of internal electrodes directly into the ceramic capacitor body structure. The extended portions are formed as continuous extensions of the internal electrodes rather than separate components. This merging approach reduces the number of discrete parts and simplifies the manufacturing process while achieving the desired low ESL performance and reliable connections for substrate embedding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces breakages and cracks, ensures reliable connections, and is suitable for embedding into substrates with lower ESL, enhancing the ceramic capacitor's suitability for high-frequency applications.
Implementation Method 1
shocks applied to the ceramic capacitor are diffused effectively
Implementation Method 2
improving adhesion to substrates
Data Source
AI summary
In a planar view of a ceramic capacitor that has low ESL and is embeddable into a substrate, lengths of first and second external electrodes are L1, lengths from portions of the first and second external electrodes farthest from a capacitor main body to portions closer to the capacitor main body by about 40% of a thickness of the first or second external electrode in a laminating direction are L2, a ratio L2/L1 is about 80% or more and about 90% or less. In the planar view, a length of a third external electrode is L3, a length from a portion of the third external electrode farthest from the capacitor main body to a portion closer to the capacitor main body by about 40% of a thickness of the third external electrode in the laminating direction is L4, a ratio L4/L3 is about 80% or more.