Multilayer Ceramic Capacitor Electrode Thickness Control
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving high capacitance while maintaining reliability, particularly moisture proof reliability, as the miniaturization and increased capacitance requirements lead to thinner internal and external electrode layers, which can compromise moisture resistance.
Innovation Solution
The solution involves controlling the thickness of the electrode layers in specific directions within the ceramic body to ensure a minimum thickness of 10 μm in the length-thickness direction and 7 μm in the width-thickness direction, using a combination of conductive metal and glass in the external electrodes to enhance moisture proof reliability, and employing a sintering process to form the ceramic and electrode structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal electrode volume is significantly decreased to increase capacitance per unit volume, then the capacitance per unit volume increases, but the moisture proof reliability deteriorates
Solution Approach 1:
The patent applies local quality by differentiating the thickness requirements of external electrode layers based on their orientation relative to moisture ingress paths. The first external electrode layer (on major surfaces) is required to be 10 μm or more, while the second external electrode layer (on minor surfaces) is required to be 7 μm or more. This localized differentiation of electrode thickness provides enhanced moisture protection where most needed while maintaining overall capacitance density.
2Volume of moving object
If the external electrode layer thickness is reduced to enable miniaturization, then the device size decreases, but the moisture proof reliability deteriorates
Solution Approach 1:
The patent applies parameter changes by establishing specific minimum thickness parameters for external electrode layers (10 μm for first layer, 7 μm for second layer) to maintain moisture proof reliability. These parameter specifications ensure that even in miniaturized devices, the external electrode layers retain sufficient thickness to prevent moisture ingress, thus resolving the contradiction between device size reduction and reliability maintenance.
3Quantity of substance
If the number of stacked layers is increased to achieve high capacitance, then the capacitance increases, but the manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the external electrode structure into two distinct layers with different thickness requirements based on their functional roles. The first external electrode layer on major surfaces provides primary moisture protection, while the second external electrode layer on minor surfaces provides secondary protection. This segmentation allows for optimized manufacturing processes that can maintain high capacitance through increased stacking while managing complexity through standardized layer specifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively improves the moisture proof reliability of multilayer ceramic capacitors by maintaining capacitance while preventing moisture permeability issues, ensuring the components' reliability in compact and high-capacitance designs.
Implementation Method 1
employing a sintering process to form the ceramic and electrode structures
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, in which the external electrode each include an electrode layer electrically connected to the internal electrodes and a plating layer disposed on the electrode layer, and a thickness of the electrode layer in a cross section of the ceramic body in first and second directions is 10 μm or more.