Multilayer Ceramic Capacitor Electrode Recess for Thermal Crack Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multilayer ceramic capacitors face challenges in withstanding severe thermal expansion-induced stress, leading to cracks due to inadequate stress relief mechanisms in harsh environments.
Innovation Solution
The multilayer ceramic capacitor design incorporates a conductive resin layer recessed towards the boundary interface with a plated layer, forming a buffering layer that reduces physical shock and thermal stress, thereby preventing cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional conductive resin layer is used without a recess structure, then the external electrode maintains structural integrity, but thermal expansion-induced stress accumulates and causes cracks in the multilayer body
Solution Approach 1:
The conductive resin layer is designed with a recess structure at its boundary with the plated layer, creating a cushioning zone that absorbs thermal expansion stress before it reaches the multilayer body. This beforehand cushioning prevents stress accumulation that would otherwise cause cracks, thereby improving reliability under thermal stress conditions.
Solution Approach 2:
The invention changes the geometric parameter of the conductive resin layer by introducing a recess structure. This parameter change creates a stress-relief zone that modifies how thermal expansion stress is distributed, reducing peak stresses at critical interfaces and preventing crack formation in the multilayer body.
2Stress or pressure
If the conductive resin layer is made thicker to improve stress relief, then thermal stress absorption increases, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The conductive resin layer is segmented into regions of different thicknesses through the recess structure. This segmentation allows the layer to provide enhanced stress relief at the critical boundary interface while maintaining a thinner profile in other areas, thus improving stress relief capability without proportionally increasing overall device complexity.
Solution Approach 2:
The recess structure creates local quality variation in the conductive resin layer, concentrating the stress relief function at the boundary interface with the plated layer where it is most needed. This localized approach provides effective stress relief without requiring the entire layer to be thick, thereby controlling device complexity.
3Manufacturing precision
If a rigid electrode structure is used, then manufacturing precision is easier to achieve, but the structure cannot flex to relieve thermal expansion stress
Solution Approach 1:
The conductive resin layer with its recess structure functions as a flexible element within the electrode assembly. This flexible structure can deform to accommodate thermal expansion stress while maintaining acceptable manufacturing precision, thus resolving the contradiction between rigidity for manufacturing and flexibility for stress relief.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively mitigates crack formation by providing enhanced flexibility and stress relief, ensuring durability in extreme conditions.
Implementation Method 1
The main surface-side conductive resin layer includes a conductive resin layer recess recessed toward a side of the multilayer body at a boundary interface with the main surface-side plated layer
Implementation Method 2
a main surface-side plated layer above the main surface-side conductive resin layer
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer body and a pair of external electrodes at both end portions of the multilayer body. The external electrodes include a main surface-side external electrode. The main surface-side external electrode includes a main surface-side base electrode layer, a main surface-side conductive resin layer above the main surface-side base electrode layer, and a main surface-side plated layer above the main surface-side conductive resin layer. The main surface-side conductive resin layer includes a conductive resin layer recess recessed towards a side of the multilayer body at a boundary interface with the main surface-side plated layer, in a cross-sectional view along the lamination direction and the length direction.